Invention Application
- Patent Title: ELECTROSTATIC CHUCK THAT INCLUDES UPPER CERAMIC LAYER THAT INCLUDES A DIELECTRIC LAYER, AND RELATED METHODS AND STRUCTURES
-
Application No.: US17974019Application Date: 2022-10-26
-
Publication No.: US20230136703A1Publication Date: 2023-05-04
- Inventor: Yan Liu , Jakub Rybczynski , Caleb Minsky , Steven Donnell
- Applicant: ENTEGRIS, INC.
- Applicant Address: US MA Billerica
- Assignee: ENTEGRIS, INC.
- Current Assignee: ENTEGRIS, INC.
- Current Assignee Address: US MA Billerica
- Main IPC: H01L21/683
- IPC: H01L21/683 ; C23C16/40 ; C23C16/455
Abstract:
Described are electrostatic chuck devices that are useful to support a workpiece while processing the workpiece, upper ceramic layer components of electrostatic chuck assemblies, the upper ceramic layer having a deposited dielectric layer, a relatively smooth finish, or both, and related methods.
Information query
IPC分类:
