Invention Publication
- Patent Title: REVERSE RECOVERY CHARGE REDUCTION IN SEMICONDUCTOR DEVICES
-
Application No.: US18469780Application Date: 2023-09-19
-
Publication No.: US20240014261A1Publication Date: 2024-01-11
- Inventor: Shengling DENG , Dean E. PROBST , Zia HOSSAIN
- Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Applicant Address: US AZ Scottsdale
- Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Current Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Current Assignee Address: US AZ Scottsdale
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L29/78 ; H01L29/739 ; H01L29/868 ; H01L29/66 ; H01L29/08 ; H01L29/10

Abstract:
In a general aspect, a method can include forming well region of one conductivity type in a semiconductor region of another conductivity type An interface between the well region and the semiconductor region can define a diode junction at a depth below an upper surface of the semiconductor region. The method can further include forming at least one dielectric region in the semiconductor region. A dielectric region of the at least one dielectric region can have an upper surface that is disposed in the well region at a depth in the semiconductor region that is above the depth of the diode junction; and a lower surface that is disposed in the semiconductor region at a depth in the semiconductor region that is the same depth as the diode junction or below the depth of the diode junction.
Public/Granted literature
- US12278266B2 Reverse recovery charge reduction in semiconductor devices Public/Granted day:2025-04-15
Information query
IPC分类: