Invention Publication
- Patent Title: SEMICONDUCTOR IMAGE-SENSING STRUCTURE
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Application No.: US17813947Application Date: 2022-07-21
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Publication No.: US20240030256A1Publication Date: 2024-01-25
- Inventor: WEI-LIN CHEN , YU-CHENG TSAI , CHUN-HAO CHOU , KUO-CHENG LEE
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Applicant Address: TW HSINCHU
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee Address: TW HSINCHU
- Main IPC: H01L27/146
- IPC: H01L27/146

Abstract:
A semiconductor image sensing structure includes a semiconductor substrate having a front side and a back side, a pixel sensor disposed in the semiconductor substrate, a transistor disposed over the front side of the semiconductor substrate, and a reflective structure disposed over the front side of the semiconductor substrate. A gate structure of the transistor and the reflective structure include a same material. A top surface of the gate structure of the transistor and a top surface of the reflective structure are aligned with each other.
Public/Granted literature
- US12302658B2 Semiconductor image-sensing structure Public/Granted day:2025-05-13
Information query
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