Invention Publication
- Patent Title: IC PACKAGE WITH LEDS
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Application No.: US17949857Application Date: 2022-09-21
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Publication No.: US20240097079A1Publication Date: 2024-03-21
- Inventor: Brandon C. MARIN , Khaled AHMED , Srinivas V. PIETAMBARAM , Hiroki TANAKA , Paul WEST , Kristof DARMAWIKARTA , Gang DUAN , Jeremy D. ECTON , Suddhasattwa NAD
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Main IPC: H01L33/48
- IPC: H01L33/48 ; H01L25/075 ; H01L33/00 ; H01L33/32 ; H01L33/62

Abstract:
Integrated circuit (IC) packages are disclosed. In some embodiments, an IC package includes a glass substrate, a micro light emitting diode (LED), a semiconductor die, one or more through glass vias (TGVs) and a package substrate. The micro LED is positioned over the glass substrate. The TGVs are integrated into the glass substrate and connect the micro LED to the semiconductor die. The semiconductor die is connected to the package substrate to receive external signals when connected to a motherboard.
Information query
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