- 专利标题： IMPLANTATION OF SPECIES ON GLASS CORE SURFACE FOR LOW LOSS AND HIGH STRENGTH APPLICATIONS
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申请号： US17954288申请日： 2022-09-27
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公开(公告)号： US20240105571A1公开(公告)日： 2024-03-28
- 发明人: Brandon C. MARIN , Haobo CHEN , Bai NIE , Srinivas V. PIETAMBARAM , Gang DUAN , Jeremy D. ECTON , Suddhasattwa NAD
- 申请人： Intel Corporation
- 申请人地址： US CA Santa Clara
- 专利权人： Intel Corporation
- 当前专利权人： Intel Corporation
- 当前专利权人地址： US CA Santa Clara
- 主分类号： H01L23/498
- IPC分类号： H01L23/498 ; H01L21/48
摘要：
Embodiments disclosed herein include glass cores and methods of forming glass cores. In an embodiment, a core for an electronic package comprises a substrate with a first surface and a second surface opposite from the first surface, where the substrate comprises glass, In an embodiment, a via opening is provided through the substrate, and a diffusion layer is along the first surface, the second surface, and the via opening.
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