Invention Publication
- Patent Title: APPARATUS FOR PROCESSING A SUBSTRATE
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Application No.: US18496224Application Date: 2023-10-27
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Publication No.: US20240145264A1Publication Date: 2024-05-02
- Inventor: Sungho KIM , Jungsoo LEE , Hyekyoung KIM
- Applicant: SEMES CO., LTD.
- Applicant Address: KR Cheonan-si
- Assignee: SEMES CO., LTD.
- Current Assignee: SEMES CO., LTD.
- Current Assignee Address: KR Cheonan-si
- Priority: KR 20220142598 2022.10.31
- Main IPC: H01L21/67
- IPC: H01L21/67

Abstract:
An apparatus for processing a substrate may include a drying chamber configured to dry at least two divided substrates from an original substrate, the drying chamber may have a drying space where the at least two divided substrates disposed therein. The apparatus for processing a substrate may include a dryness compensation part configured to compensate a difference of drynesses of chemical liquids coated on the at least two divided substrates such that the chemical liquids coated on the at least two divided substrates has a substantially same dryness.
Information query
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