公开(公告)号：US20240145264A1

公开(公告)日：2024-05-02

申请号：US18496224

申请日：2023-10-27

Applicant: SEMES CO., LTD.

Inventor： Sungho KIM ,  Jungsoo LEE ,  Hyekyoung KIM

IPC: H01L21/67

CPC classification number: H01L21/67034 ,  H01L21/67017

Abstract: An apparatus for processing a substrate may include a drying chamber configured to dry at least two divided substrates from an original substrate, the drying chamber may have a drying space where the at least two divided substrates disposed therein. The apparatus for processing a substrate may include a dryness compensation part configured to compensate a difference of drynesses of chemical liquids coated on the at least two divided substrates such that the chemical liquids coated on the at least two divided substrates has a substantially same dryness.