发明公开
- 专利标题: ADHESIVE COMPOSITION, BONDED BODY AND PRODUCTION METHOD FOR AN ADHESIVE COMPOSITION
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申请号: US18284506申请日: 2022-03-23
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公开(公告)号: US20240174893A1公开(公告)日: 2024-05-30
- 发明人: Yusuke TAKAHASHI , Chiaki TAKANO , Hiroyuki KURIMURA
- 申请人: DENKA COMPANY LIMITED
- 申请人地址: JP Tokyo
- 专利权人: DENKA COMPANY LIMITED
- 当前专利权人: DENKA COMPANY LIMITED
- 当前专利权人地址: JP Tokyo
- 优先权: JP 21059627 2021.03.31
- 国际申请: PCT/JP2022/013513 2022.03.23
- 进入国家日期: 2023-09-27
- 主分类号: C09J4/00
- IPC分类号: C09J4/00 ; C09J11/06 ; C09J11/08 ; C09J151/00
摘要:
An adhesive composition including a polymerizable monomer having a (meth)acryloyl group; a radical polymerization initiator; and a polymer particle having a property of being swollen by an organic solvent, in which in a particle size distribution of secondary particles which are aggregates of the polymer particles, the secondary particles being in the adhesive composition and the particle size distribution being determined by a laser diffraction/scattering method, a proportion of secondary particles having a diameter of 1 μm or more and 200 μm or less is 30% by volume or more.
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