公开(公告)号：US20240174893A1

公开(公告)日：2024-05-30

申请号：US18284506

申请日：2022-03-23

Applicant: DENKA COMPANY LIMITED

Inventor： Yusuke TAKAHASHI ,  Chiaki TAKANO ,  Hiroyuki KURIMURA

IPC: C09J4/00 ,  C09J11/06 ,  C09J11/08 ,  C09J151/00

CPC classification number: C09J4/00 ,  C09J11/06 ,  C09J11/08 ,  C09J151/003

Abstract: An adhesive composition including a polymerizable monomer having a (meth)acryloyl group; a radical polymerization initiator; and a polymer particle having a property of being swollen by an organic solvent, in which in a particle size distribution of secondary particles which are aggregates of the polymer particles, the secondary particles being in the adhesive composition and the particle size distribution being determined by a laser diffraction/scattering method, a proportion of secondary particles having a diameter of 1 μm or more and 200 μm or less is 30% by volume or more.

公开(公告)号：US20230416578A1

公开(公告)日：2023-12-28

申请号：US18034624

申请日：2021-10-27

Applicant: DENKA COMPANY LIMITED

Inventor： Yusuke TAKAHASHI ,  Chiaki TAKANO

IPC: C09J151/00 ,  C08F290/04 ,  C09K11/02 ,  C09J5/06 ,  C09J4/06 ,  G01N21/64

CPC classification number: C09J151/003 ,  C08F290/048 ,  C09K11/02 ,  C09J5/06 ,  C09J2400/166 ,  G01N21/6428 ,  C09J2451/00 ,  C09J2400/246 ,  C09J4/06

Abstract: A curable composition containing a polymerizable compound (A) and a polymerization initiator (B). A half width of a temperature-loss tangent (tan δ) graph is 90° C. or higher and 150° C. or lower, where the half width is obtained by measuring a dynamic viscoelasticity of a cured substance of this curable composition under measurement conditions of frequency: 1.0 Hz, mode: tensile mode, measurement temperature range: −50° C. to 200° C., and temperature rising rate: 2° C./min.