-
公开(公告)号：US20240174893A1
公开(公告)日：2024-05-30
申请号：US18284506
申请日：2022-03-23
IPC分类号： C09J4/00 , C09J11/06 , C09J11/08 , C09J151/00
CPC分类号： C09J4/00 , C09J11/06 , C09J11/08 , C09J151/003
摘要： An adhesive composition including a polymerizable monomer having a (meth)acryloyl group; a radical polymerization initiator; and a polymer particle having a property of being swollen by an organic solvent, in which in a particle size distribution of secondary particles which are aggregates of the polymer particles, the secondary particles being in the adhesive composition and the particle size distribution being determined by a laser diffraction/scattering method, a proportion of secondary particles having a diameter of 1 μm or more and 200 μm or less is 30% by volume or more.
-
公开(公告)号：US20230416578A1
公开(公告)日：2023-12-28
申请号：US18034624
申请日：2021-10-27
发明人： Yusuke TAKAHASHI , Chiaki TAKANO
IPC分类号： C09J151/00 , C08F290/04 , C09K11/02 , C09J5/06 , C09J4/06 , G01N21/64
CPC分类号： C09J151/003 , C08F290/048 , C09K11/02 , C09J5/06 , C09J2400/166 , G01N21/6428 , C09J2451/00 , C09J2400/246 , C09J4/06
摘要： A curable composition containing a polymerizable compound (A) and a polymerization initiator (B). A half width of a temperature-loss tangent (tan δ) graph is 90° C. or higher and 150° C. or lower, where the half width is obtained by measuring a dynamic viscoelasticity of a cured substance of this curable composition under measurement conditions of frequency: 1.0 Hz, mode: tensile mode, measurement temperature range: −50° C. to 200° C., and temperature rising rate: 2° C./min.
-
搜索结果
2 条记录 (耗时 0.015 秒)
