公开(公告)号：US20240376307A1

公开(公告)日：2024-11-14

申请号：US18691557

申请日：2022-09-26

Applicant: DENKA COMPANY LIMITED

Inventor： Hideki HAYASHI ,  Hiroyuki KURIMURA

IPC: C08L51/00 ,  C08K5/098 ,  C08L9/02 ,  C09J5/04 ,  C09J11/06 ,  C09J109/02 ,  C09J151/00

Abstract: A two-agent type composition consisting of first agent and second agent, wherein: first agent contains an elastomer, a first and second acrylic component, a second acrylic component, and a polymerization initiator; second agent contains condensate of amine and aldehyde, third acrylic component, and reducing agent; the first acrylic component is (meth)acrylate or (meth)acrylic acid, containing two or more hydroxyl groups bonded to a carbon atom in one molecule, or containing one or more functional groups of one or more kind of functional groups selected from group consisting of an amide group, a cyclic amide group, a sulfoxide group, a ketone group, an aldehyde group, a sulfo group, a sulfino group, a phosphonic group, a sulfobetaine group, a carbobetaine group, and a phosphobetaine group in one molecule; second acrylic component is a (meth)acrylate or (meth)acrylic acid other than first acrylic component; and the third acrylic component is (meth)acrylate or (meth)acrylic acid.

公开(公告)号：US20240174893A1

公开(公告)日：2024-05-30

申请号：US18284506

申请日：2022-03-23

Applicant: DENKA COMPANY LIMITED

Inventor： Yusuke TAKAHASHI ,  Chiaki TAKANO ,  Hiroyuki KURIMURA

IPC: C09J4/00 ,  C09J11/06 ,  C09J11/08 ,  C09J151/00

CPC classification number: C09J4/00 ,  C09J11/06 ,  C09J11/08 ,  C09J151/003

Abstract: An adhesive composition including a polymerizable monomer having a (meth)acryloyl group; a radical polymerization initiator; and a polymer particle having a property of being swollen by an organic solvent, in which in a particle size distribution of secondary particles which are aggregates of the polymer particles, the secondary particles being in the adhesive composition and the particle size distribution being determined by a laser diffraction/scattering method, a proportion of secondary particles having a diameter of 1 μm or more and 200 μm or less is 30% by volume or more.

公开(公告)号：US20180141181A1

公开(公告)日：2018-05-24

申请号：US15577036

申请日：2016-05-20

Applicant: Sharp Kabushiki Kaisha ,  Denka Company Limited

Inventor： Youhei NAKANISHI ,  Masayuki KANEHIRO ,  Hiroyuki KURIMURA ,  Yasunori ISHIDA ,  Takuya AMADA ,  Koodi HASHIMOTO

IPC: B24B5/04 ,  G02F1/13 ,  B24B9/14

CPC classification number: B24B5/042 ,  B24B9/14 ,  B24B13/015 ,  G02F1/13 ,  G02F1/133351 ,  G02F1/1339 ,  G02F2201/56 ,  G02F2202/023

Abstract: A method of collectively producing display panels each having an outline a part of which is curved includes a bonded substrate forming process of bonding substrates in a pair one of which has thin film patterns and forming a bonded substrate 50, a layering process of layering multiple bonded substrates 50 via curing resin 60 and curing the curing resin 60, a grinding process of collectively grinding the substrates in a pair and the curing resin 60 that are outside the thin film pattern on each of the bonded substrates 50B that are layered on each other along the outline and collectively forming edge surfaces of the display panels each having the curved outline, and a separation process of separating each of the bonded substrates 50B that are layered on each other from the curing resin 60.