公开(公告)号：US20200231726A1

公开(公告)日：2020-07-23

申请号：US16628899

申请日：2018-09-19

Applicant: DENKA COMPANY LIMITED

Inventor： Hideki HAYASHI ,  Yoshitsugu GOTO ,  Chiaki TAKANO

IPC: C08F220/20 ,  C09J11/06 ,  C09J4/06 ,  C08F220/14

Abstract: A composition having excellent curability and adhesive bonding ability is provided. A composition, comprising the following components (1) to (5): (1) a polymerizable vinyl monomer containing 10 to 70 parts by mass of (1-1), 10 to 60 parts by mass of (1-2), and 10 to 60 parts by mass of (1-3) based on 100 parts by mass of (1) the polymerizable vinyl monomer, in which (1-1) is a (meth)acrylic monomer represented by the formula (A) Formula (A) Z—O—R1 (wherein, Z represents a (meth)acryloyl group, and R1 represents an alkyl group.), (1-2) is a (meth)acrylic monomer represented by the formula (B) (wherein, Z and Z′ represent a (meth)acryloyl group, and R2 and R2′ represent an alkylene group; R2 and R2′ may be the same as or different from one another; R3 and R3′ represent a hydrogen atom, or an alkyl group having 1 to 4 carbon atoms; R3 and R3′ may be the same as or different from one another; m and n represent an average number of moles of alkylene oxide added (proportion of alkylene oxide added)), (1-3) is a (meth)acrylic monomer that is a (meth)acrylic acid ester of a polyhydric alcohol; (2) a thermal radical polymerization initiator; (3) a photo-radical polymerization initiator; (4) an aromatic amine and/or pyridine derivative; and (5) an organic metal salt,

公开(公告)号：US20240174893A1

公开(公告)日：2024-05-30

申请号：US18284506

申请日：2022-03-23

Applicant: DENKA COMPANY LIMITED

Inventor： Yusuke TAKAHASHI ,  Chiaki TAKANO ,  Hiroyuki KURIMURA

IPC: C09J4/00 ,  C09J11/06 ,  C09J11/08 ,  C09J151/00

CPC classification number: C09J4/00 ,  C09J11/06 ,  C09J11/08 ,  C09J151/003

Abstract: An adhesive composition including a polymerizable monomer having a (meth)acryloyl group; a radical polymerization initiator; and a polymer particle having a property of being swollen by an organic solvent, in which in a particle size distribution of secondary particles which are aggregates of the polymer particles, the secondary particles being in the adhesive composition and the particle size distribution being determined by a laser diffraction/scattering method, a proportion of secondary particles having a diameter of 1 μm or more and 200 μm or less is 30% by volume or more.

公开(公告)号：US20230416578A1

公开(公告)日：2023-12-28

申请号：US18034624

申请日：2021-10-27

Applicant: DENKA COMPANY LIMITED

Inventor： Yusuke TAKAHASHI ,  Chiaki TAKANO

IPC: C09J151/00 ,  C08F290/04 ,  C09K11/02 ,  C09J5/06 ,  C09J4/06 ,  G01N21/64

CPC classification number: C09J151/003 ,  C08F290/048 ,  C09K11/02 ,  C09J5/06 ,  C09J2400/166 ,  G01N21/6428 ,  C09J2451/00 ,  C09J2400/246 ,  C09J4/06

Abstract: A curable composition containing a polymerizable compound (A) and a polymerization initiator (B). A half width of a temperature-loss tangent (tan δ) graph is 90° C. or higher and 150° C. or lower, where the half width is obtained by measuring a dynamic viscoelasticity of a cured substance of this curable composition under measurement conditions of frequency: 1.0 Hz, mode: tensile mode, measurement temperature range: −50° C. to 200° C., and temperature rising rate: 2° C./min.