A method for manufacturing a wiring board includes steps of: (I) forming an insulation material layer on a surface of a support substrate; (II) forming a first conductive layer on a surface of the insulation material layer by electroless copper plating; (III) forming a first opening passing through the first conductive layer and the insulation material layer; (IV) forming a second conductive layer on a surface of the first conductive layer and on a bottom surface and a side surface of the first opening by electroless copper plating; (V) forming a resist pattern having a second opening communicating with the first opening on a surface of the second conductive layer; and (VI) filling the first opening and the second opening with a conductive material including copper by electrolytic copper plating.