- 专利标题： METHODS AND APPARATUS TO REDUCE DELAMINATION IN HYBRID CORES
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申请号： US18756679申请日： 2024-06-27
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公开(公告)号： US20240347402A1公开(公告)日： 2024-10-17
- 发明人: Jeremy Ecton , Brandon Christian Marin , Srinivas Venkata Ramanuja Pietambaram , Gang Duan , Leonel Arana , Benjamin Duong
- 申请人： Intel Corporation
- 申请人地址： US CA Santa Clara
- 专利权人： Intel Corporation
- 当前专利权人： Intel Corporation
- 当前专利权人地址： US CA Santa Clara
- 主分类号： H01L23/13
- IPC分类号： H01L23/13 ; H01L23/15 ; H01L25/065
摘要：
Methods and apparatus to reduce delamination in hybrid cores are disclosed. An example hybrid core of an integrated circuit (IC) package comprises a frame, and a glass panel including a top surface, an edge adjacent the frame, and a tapered surface extending between the edge and the top surface.
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