Invention Application
- Patent Title: SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE
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Application No.: US18790119Application Date: 2024-07-31
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Publication No.: US20240395727A1Publication Date: 2024-11-28
- Inventor: Chih-Hao Chen , Pu Wang , Li-Hui Cheng , Szu-Wei Lu
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Main IPC: H01L23/538
- IPC: H01L23/538 ; H01L21/48 ; H01L21/56 ; H01L21/683 ; H01L23/00 ; H01L23/31 ; H01L25/00 ; H01L25/065 ; H01L25/10
Abstract:
Semiconductor devices and methods of manufacture are provided, in which an adhesive is removed from a semiconductor die embedded within an encapsulant, and an interface material is utilized to remove heat from the semiconductor device. The removal of the adhesive leaves behind a recess adjacent to a sidewall of the semiconductor, and the recess is filled.
Information query
IPC分类:
