Invention Application
- Patent Title: SEMICONDUCTOR DEVICE ISOLATION OF CONTACT AND SOURCE/DRAIN STRUCTURES
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Application No.: US18489367Application Date: 2023-10-18
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Publication No.: US20240429292A1Publication Date: 2024-12-26
- Inventor: Chun-Yuan CHEN , Huan-Chieh SU , Kuo-Cheng CHIANG , Chih-Hao WANG
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Main IPC: H01L29/417
- IPC: H01L29/417 ; H01L21/285 ; H01L21/8234 ; H01L27/088 ; H01L29/06 ; H01L29/08 ; H01L29/423 ; H01L29/45 ; H01L29/66 ; H01L29/775

Abstract:
The present disclosure describes a semiconductor device having a contact structure isolated from a source/drain structure. The semiconductor structure includes a gate structure on a substrate, first and second source/drain (S/D) structures on opposite sides of the gate structure, an isolation layer on the second S/D structure, a third S/D structure adjacent to and separate from the second S/D structure, and a S/D contact structure on the isolation layer and the third S/D structure. The isolation layer separates the S/D contact structure from the second S/D structure.
Information query
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