Invention Grant
US3790451A Electrodeposition of copper from sulfur-free cyanide electrolytes using periodic reverse current
失效
使用周期性反向电流从无硫氰化物电解质中电沉积铜
- Patent Title: Electrodeposition of copper from sulfur-free cyanide electrolytes using periodic reverse current
- Patent Title (中): 使用周期性反向电流从无硫氰化物电解质中电沉积铜
-
Application No.: US3790451DApplication Date: 1969-08-29
-
Publication No.: US3790451APublication Date: 1974-02-05
- Inventor: WEISENBERGER L , BIORA J
- Applicant: RICHARDSON CHEMICAL CO
- Assignee: Richardson Chemical Co
- Current Assignee: Richardson Chemical Co
- Priority: US85409469 1969-08-29
- Main IPC: C25D3/40
- IPC: C25D3/40 ; H05K3/42 ; C23B5/48
Abstract:
A PROCESS FOR ELECTROPLATING COPPER ON A BASE MEMBER COMPRISING APPLYING TO THE MEMBER AN ESSENTIALLY SULFURFREE AQUEOUS ALKALINE CYANIDE PLATING BATH COMRPISING A SOURCE OF COPPER, AN ACETYLENIC ALCOHOL, A COMPLEXING AGENT AND A HYDROXY ACID. CURRENT IS CAUSED TO FLOW THROUGH THE MEMBER WHILE IN CONTACT WITH THE PLATING BATH FOR A PERIOD OF 20-60 SECONDS TO ELECTROPLATE COPPER ON SAID MEMBER. THEREAFTER A DEPLATING ELECTRIC CURRENT IS CAUSED TO FLOW THROUGH SAID MEMBER FOR A PERIOD OF 6-20 SECONDS TO DEPLATE A PART OF THE COPPER PLATED ON THE MEMBER. ALTERNATE PLATING AND DEPLATING CYCLES ARE CONTINUED UNTIL A DESIRED THICKNESS OF COPPER HAS BEEN DEPOSITED ON THE MEMBER.
Information query
