公开(公告)号：US3790451A

公开(公告)日：1974-02-05

申请号：US3790451D

申请日：1969-08-29

Applicant: RICHARDSON CHEMICAL CO

Inventor： WEISENBERGER L ,  BIORA J

IPC: C25D3/40 ,  H05K3/42 ,  C23B5/48

CPC classification number: C25D3/40 ,  H05K3/423 ,  Y10S204/09

Abstract: A PROCESS FOR ELECTROPLATING COPPER ON A BASE MEMBER COMPRISING APPLYING TO THE MEMBER AN ESSENTIALLY SULFURFREE AQUEOUS ALKALINE CYANIDE PLATING BATH COMRPISING A SOURCE OF COPPER, AN ACETYLENIC ALCOHOL, A COMPLEXING AGENT AND A HYDROXY ACID. CURRENT IS CAUSED TO FLOW THROUGH THE MEMBER WHILE IN CONTACT WITH THE PLATING BATH FOR A PERIOD OF 20-60 SECONDS TO ELECTROPLATE COPPER ON SAID MEMBER. THEREAFTER A DEPLATING ELECTRIC CURRENT IS CAUSED TO FLOW THROUGH SAID MEMBER FOR A PERIOD OF 6-20 SECONDS TO DEPLATE A PART OF THE COPPER PLATED ON THE MEMBER. ALTERNATE PLATING AND DEPLATING CYCLES ARE CONTINUED UNTIL A DESIRED THICKNESS OF COPPER HAS BEEN DEPOSITED ON THE MEMBER.