公开(公告)号：US3871974A

公开(公告)日：1975-03-18

申请号：US40024073

申请日：1973-09-24

Applicant: RICHARDSON CHEMICAL CO

Inventor： DUCHENE JOSEPH R ,  DECHRISTOPHER PHILLIP J

IPC: C25D3/22 ,  C23B5/10 ,  C23B5/46

CPC classification number: C25D3/22

Abstract: Non-cyanide, alkaline electroplating baths for bright zinc plating containing quarternized polymeric condensates of alkylene polyamines and epihalohydrins in admixture with alkdehyde type brightners and mercapto substituted heterocyclic compounds capable of producing bright deposits over a broad current density range.

Abstract translation: 非氰化物，碱性电镀浴，用于光亮镀锌，其含有亚烷基多胺和表卤代醇与甲醛型光亮剂和巯基取代的杂环化合物的季铵化聚合物缩合物，其能够在宽电流密度范围内产生明亮的沉积物。

公开(公告)号：US3886054A

公开(公告)日：1975-05-27

申请号：US40042773

申请日：1973-09-24

Applicant: RICHARDSON CHEMICAL CO

Inventor： DUCHENE JOSEPH R ,  DE CHRISTOPHER PHILIP J

IPC: C25D3/22 ,  C23B5/10 ,  C23B5/46

CPC classification number: C25D3/22

Abstract: Non-cyanide, alkaline electroplating baths for bright zinc plating containing quarternized polymeric condensates of alkylene polyamines and 1,3-dihalo-2-propanol as grain refiners preferably in admixture with aldehyde type brighteners and mercapto substituted heterocyclic compounds capable of producing the bright, fine grained deposits over a broad current density range.

Abstract translation: 非氰化物，碱性电镀浴，用于光亮镀锌，含有亚烷基多胺和1,3-二卤代-2-丙醇作为晶粒细化剂的季铵化聚合物缩合物，优选与醛型增白剂和能够产生光亮的细小的巯基取代的杂环化合物混合 颗粒沉积物在宽电流密度范围内。

公开(公告)号：US3790451A

公开(公告)日：1974-02-05

申请号：US3790451D

申请日：1969-08-29

Applicant: RICHARDSON CHEMICAL CO

Inventor： WEISENBERGER L ,  BIORA J

IPC: C25D3/40 ,  H05K3/42 ,  C23B5/48

CPC classification number: C25D3/40 ,  H05K3/423 ,  Y10S204/09

Abstract: A PROCESS FOR ELECTROPLATING COPPER ON A BASE MEMBER COMPRISING APPLYING TO THE MEMBER AN ESSENTIALLY SULFURFREE AQUEOUS ALKALINE CYANIDE PLATING BATH COMRPISING A SOURCE OF COPPER, AN ACETYLENIC ALCOHOL, A COMPLEXING AGENT AND A HYDROXY ACID. CURRENT IS CAUSED TO FLOW THROUGH THE MEMBER WHILE IN CONTACT WITH THE PLATING BATH FOR A PERIOD OF 20-60 SECONDS TO ELECTROPLATE COPPER ON SAID MEMBER. THEREAFTER A DEPLATING ELECTRIC CURRENT IS CAUSED TO FLOW THROUGH SAID MEMBER FOR A PERIOD OF 6-20 SECONDS TO DEPLATE A PART OF THE COPPER PLATED ON THE MEMBER. ALTERNATE PLATING AND DEPLATING CYCLES ARE CONTINUED UNTIL A DESIRED THICKNESS OF COPPER HAS BEEN DEPOSITED ON THE MEMBER.

公开(公告)号：US3709798A

公开(公告)日：1973-01-09

申请号：US3709798D

申请日：1971-10-13

Applicant: RICHARDSON CHEMICAL CO

Inventor： DUCHENE J

IPC: C25D3/12 ,  C23B5/08

CPC classification number: C25D3/12

Abstract: AN AQUEOUS ACIDIC BATH SOLUTION FOR ELECTROPLATING NICKEL INCLUDES AT LEAST ONE NICKEL SALT AS A SOURCE OF NICKEL AND, AS A BRIGHTENER, A COMBINATION OF AN OXYETHYLENATED SULFOLENE COMPOUND AND A WATER-SOLUBLE ALLYL SULFONATE IN AN AMOUNT SUFFICIENT TO PRODUCE A BRIGHT NICKEL ELECTRODEPOSIT.

公开(公告)号：US3769181A

公开(公告)日：1973-10-30

申请号：US3769181D

申请日：1971-07-21

Applicant: RICHARDSON CHEMICAL CO

Inventor： BIORA J ,  WILKI C

IPC: C25D5/22 ,  C23B5/48

CPC classification number: C25D5/22

Abstract: A conductive workpiece is simultaneously machined and electroplated by using a rotatable maching tool against the surface of the workpiece being electroplated and by delivering the electroplating solution thereto under high current density. The electroplating solution comprises an aqueous solution containing one of bronze, cobalt and chromium.

Abstract translation: 通过使用可旋转的加工工具抵抗正在被电镀的工件的表面并且以高电流密度递送电镀溶液，同时对导电工件进行加工和电镀。 电镀溶液包含含有青铜，钴和铬之一的水溶液。