发明授权
- 专利标题： Method for providing a top seal coating on a substrate containing an electrically conductive pattern and coated article
- 专利标题（中）： 在包含导电图案和涂覆制品的基材上提供顶部密封涂层的方法
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申请号： US628980申请日： 1984-07-12
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公开(公告)号： US4592944A公开(公告)日： 1986-06-03
- 发明人: Roger J. Clark , James Economy , Mary A. Flandera , John R. Susko , Wheater, Robin A.
- 申请人： Roger J. Clark , James Economy , Mary A. Flandera , John R. Susko , Wheater, Robin A.
- 申请人地址： NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： NY Armonk
- 主分类号： G03F7/025
- IPC分类号： G03F7/025 ; H01L21/312 ; H01L23/14 ; H01L23/498 ; B05D5/12
摘要：
An electronic circuit having an electrically conductive pattern formed on a substrate and having on at least one surface of the substrate a film obtained from a soluble polymerizable oligomer of the formula: ##STR1## wherein M is --C.tbd.C--, --C.tbd.C--C.tbd.C, --O--, ##STR2## wherein R is an alkyl or aromatic group; wherein Ar is an aromatic group; wherein X is an integer greater than two but less than 30, z is either zero or an integer, and y is an integer with the sum of y and z equal to x; and wherein n is an integer from 1 to 10. The substrate is coated by applying the above composition to the substrate and then hardening the composition by further polymerization. Preferred compositions contain the above described oligomer and certain plasticizers and/or toughening agents.
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