公开(公告)号：US4592944A

公开(公告)日：1986-06-03

申请号：US628980

申请日：1984-07-12

申请人： Roger J. Clark ,  James Economy ,  Mary A. Flandera ,  John R. Susko ,  Wheater, Robin A.

发明人： Roger J. Clark ,  James Economy ,  Mary A. Flandera ,  John R. Susko ,  Wheater, Robin A.

IPC分类号： G03F7/025 ,  H01L21/312 ,  H01L23/14 ,  H01L23/498 ,  B05D5/12

CPC分类号： H01L21/312 ,  G03F7/025 ,  H01L23/145 ,  H01L23/49894 ,  H01L2924/0002 ,  Y10S428/901 ,  Y10T428/24802 ,  Y10T428/24926

摘要： An electronic circuit having an electrically conductive pattern formed on a substrate and having on at least one surface of the substrate a film obtained from a soluble polymerizable oligomer of the formula: ##STR1## wherein M is --C.tbd.C--, --C.tbd.C--C.tbd.C, --O--, ##STR2## wherein R is an alkyl or aromatic group; wherein Ar is an aromatic group; wherein X is an integer greater than two but less than 30, z is either zero or an integer, and y is an integer with the sum of y and z equal to x; and wherein n is an integer from 1 to 10. The substrate is coated by applying the above composition to the substrate and then hardening the composition by further polymerization. Preferred compositions contain the above described oligomer and certain plasticizers and/or toughening agents.

摘要翻译： 一种具有导电图形的电子电路，其形成在基板上，并且在所述基板的至少一个表面上具有由下式的可溶性可聚合低聚物获得的膜：其中M是-C 其中R是烷基或芳族基团;其中R是烷基或芳基; 其中Ar是芳基; 其中X是大于2但小于30的整数，z是零或整数，y是y和z之和等于x的整数; 并且其中n是1至10的整数。通过将上述组合物施加到基材上然后通过进一步聚合硬化组合物来涂覆基材。 优选的组合物含有上述低聚物和某些增塑剂和/或增韧剂。