发明授权
- 专利标题： Conductive metallization of substrates via developing agents
- 专利标题（中）： 通过显影剂对衬底的导电金属化
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申请号： US204068申请日： 1988-06-06
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公开(公告)号： US4997674A公开(公告)日： 1991-03-05
- 发明人: William J. E. Parr , Ronald E. Hutton , Paul Y. Y. Moy , Dieter Frank , David A. Strawser
- 申请人： William J. E. Parr , Ronald E. Hutton , Paul Y. Y. Moy , Dieter Frank , David A. Strawser
- 申请人地址： NY New York
- 专利权人： Akzo America Inc.
- 当前专利权人： Akzo America Inc.
- 当前专利权人地址： NY New York
- 主分类号： B22F7/04
- IPC分类号： B22F7/04 ; B32B15/08 ; C23C4/18 ; C23C24/06 ; C23C24/08 ; H01B1/22 ; H01B13/00 ; H05K3/02 ; H05K3/10 ; H05K3/14 ; H05K3/20 ; H05K3/24
摘要：
A conductive metal layer is formed on a substrate by depositing copper or nickel particles on the substrate, contacting the metal particles with a specified developing agent, and heating the metal particles and the developing agent. The coated substrates have conductive surfaces and are useful for a variety of uses such as EMI shielding and printed circuit boards.
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