公开(公告)号：US5059485A

公开(公告)日：1991-10-22

申请号：US437289

申请日：1989-11-16

申请人： William J. Parr ,  Paul Y. Y. Moy ,  Dieter Frank

发明人： William J. Parr ,  Paul Y. Y. Moy ,  Dieter Frank

IPC分类号： C23C4/18 ,  C23C24/08 ,  H01B1/22 ,  H05K3/14 ,  H05K3/20

CPC分类号： C23C24/085 ,  C23C24/087 ,  C23C4/18 ,  H01B1/22 ,  H05K3/14 ,  H05K3/207 ,  H05K2203/0278 ,  H05K2203/122 ,  Y10T428/31681

摘要： A conductive metal layer is formed on a substrate having a softening point above about 200.degree. C. by depositing copper and nickel particles having a substantially continuous oxide coating thereon on the substrate, and heating and pressing the metal particles at a temperature of at least 200.degree. C. Unlike similar methods wherein oxide coated metal particles are used, no developing agent is required to render the metal layer conductive. The coated substrates are useful for a variety of uses such as EMI shielding and printed circuit boards.

摘要翻译： 在软化点高于约200℃的基材上形成导电金属层，通过在其上沉积基材上具有基本上连续的氧化物涂层的铜和镍颗粒，并在至少200℃的温度下加热和压制金属颗粒 不同于使用氧化物涂覆的金属颗粒的类似方法，不需要显影剂来使金属层导电。 涂覆的基材可用于各种用途，例如EMI屏蔽和印刷电路板。

公开(公告)号：US5252255A

公开(公告)日：1993-10-12

申请号：US521772

申请日：1990-06-11

申请人： Paul Y. Y. Moy ,  William J. E. Parr ,  Dieter Frank ,  Ronald E. Hutton

发明人： Paul Y. Y. Moy ,  William J. E. Parr ,  Dieter Frank ,  Ronald E. Hutton

IPC分类号： C08K3/08 ,  H01B1/22 ,  H05K9/00 ,  H01B1/00 ,  H01B1/02 ,  H01B1/20

CPC分类号： H05K9/0083 ,  C08K3/08 ,  H01B1/22

摘要： A conductive metal-filled substrate is formed by intermingling copper or nickel particles into the substrate, contacting the metal particles with a specified developing agent, and heating the metal particles and the developing agent. The filled substrates are electrically conductive and are useful for a variety of uses such as EMI shielding.

摘要翻译： 通过将铜或镍颗粒混合到基底中，使金属颗粒与指定的显影剂接触并加热金属颗粒和显影剂来形成导电金属填充的基板。 填充的基板是导电的并且可用于诸如EMI屏蔽的各种用途。

公开(公告)号：US5173519A

公开(公告)日：1992-12-22

申请号：US613840

申请日：1991-01-07

申请人： Paul Y. Y. Moy ,  William J. E. Parr ,  Dieter Frank ,  Ronald Hutton

发明人： Paul Y. Y. Moy ,  William J. E. Parr ,  Dieter Frank ,  Ronald Hutton

IPC分类号： C08K3/02 ,  C08K3/08 ,  C08K5/17 ,  C08L101/00 ,  H01B1/22 ,  H05K9/00

CPC分类号： H05K9/0083 ,  C08K3/08 ,  H01B1/22

摘要： A conductive metal-filled substrate is formed by intermingling copper or nickel particles into the substrate, contacting the metal particles with a specified developing agent, and heating the metal particles and the developing agent. The filled substrates are electrically conductive and are useful for a variety of uses such as EMI shielding.

公开(公告)号：US4801625A

公开(公告)日：1989-01-31

申请号：US90319

申请日：1987-08-27

申请人： William J. Parr ,  Arthur G. Mack ,  Paul Y. Y. Moy

发明人： William J. Parr ,  Arthur G. Mack ,  Paul Y. Y. Moy

IPC分类号： C07F9/6574 ,  C08K5/527 ,  C08K13/02 ,  C08K5/52

CPC分类号： C08K5/527 ,  C07F9/65748 ,  C08K13/02

摘要： A flame resistant composition has (1) an organic polymeric substance (such as polypropylene) in intimate contact with (2) an ether, ester, or carbonate derivative of a bicyclic phosphorous compound (such as pentaerythritol phosphate) and (3) a gas producing compound (such as melamine or ammonium polyphosphate).

公开(公告)号：US4997674A

公开(公告)日：1991-03-05

申请号：US204068

申请日：1988-06-06

申请人： William J. E. Parr ,  Ronald E. Hutton ,  Paul Y. Y. Moy ,  Dieter Frank ,  David A. Strawser

发明人： William J. E. Parr ,  Ronald E. Hutton ,  Paul Y. Y. Moy ,  Dieter Frank ,  David A. Strawser

IPC分类号： B22F7/04 ,  B32B15/08 ,  C23C4/18 ,  C23C24/06 ,  C23C24/08 ,  H01B1/22 ,  H01B13/00 ,  H05K3/02 ,  H05K3/10 ,  H05K3/14 ,  H05K3/20 ,  H05K3/24

CPC分类号： C23C24/085 ,  C23C24/087 ,  C23C4/18 ,  H01B1/22 ,  H05K3/022 ,  H05K3/102 ,  H05K3/14 ,  H05K3/20 ,  H05K3/207 ,  H05K2201/0129 ,  H05K2201/09118 ,  H05K2203/0278 ,  H05K2203/122 ,  H05K3/244

摘要： A conductive metal layer is formed on a substrate by depositing copper or nickel particles on the substrate, contacting the metal particles with a specified developing agent, and heating the metal particles and the developing agent. The coated substrates have conductive surfaces and are useful for a variety of uses such as EMI shielding and printed circuit boards.

公开(公告)号：US4961879A

公开(公告)日：1990-10-09

申请号：US204137

申请日：1988-06-08

申请人： Paul Y. Y. Moy ,  William J. E. Parr ,  Dieter Frank ,  Ronald E. Hutton

发明人： Paul Y. Y. Moy ,  William J. E. Parr ,  Dieter Frank ,  Ronald E. Hutton

IPC分类号： C08K3/02 ,  C08K3/08 ,  C08K5/17 ,  C08L101/00 ,  H01B1/22 ,  H05K9/00

CPC分类号： H05K9/0083 ,  C08K3/08 ,  H01B1/22

摘要： A conductive metal-filled substrate is formed by intermingling copper or nickel particles into the substrate, contacting the metal particles with a specified developing agent, and heating the metal particles and the developing agent. The filled substrates are electrically conductive and are useful for a variety of uses such as EMI shielding.

摘要翻译： 通过将铜或镍颗粒混合到基底中，使金属颗粒与指定的显影剂接触并加热金属颗粒和显影剂来形成导电金属填充的基板。 填充的基板是导电的并且可用于诸如EMI屏蔽的各种用途。