发明授权
- 专利标题： Method for forming a thin dielectric layer on a substrate
- 专利标题（中）： 在基板上形成薄介电层的方法
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申请号： US400300申请日： 1989-08-29
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公开(公告)号： US5051377A公开(公告)日： 1991-09-24
- 发明人: Wolfgang Euen , Dieter Hagmann , Hans-Jurgen Wildau
- 申请人： Wolfgang Euen , Dieter Hagmann , Hans-Jurgen Wildau
- 申请人地址： NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： NY Armonk
- 优先权： EPX88114239 19880901
- 主分类号： C23C14/06
- IPC分类号： C23C14/06 ; C23C14/08 ; C23C14/10 ; C23C14/48 ; H01L21/265 ; H01L21/28 ; H01L21/3105 ; H01L21/314 ; H01L21/822 ; H01L27/04
摘要：
Disclosed is a thin dielectric inorganic layer overlaying a substrate, and having a thickness of .ltoreq. about 20 nm and a defect density of .ltoreq. about 0.6 defects/cm.sup.2 determined by BV measurements.Also disclosed is a method of forming such a layer, according to which a layer having the desired composition and thickness is formed on a substrate, followed by an ion implanatation into the substrate through the layer with a dose of .gtoreq. about 10.sup.15 ions/cm.sup.2 and a subsequence anneal at a temperature of .gtoreq. about 500.degree. C. for a predetermined time.
公开/授权文献
- US6152503A Vehicle bumper 公开/授权日：2000-11-28
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