发明授权
- 专利标题: Method and apparatus for granulation and granulated product
- 专利标题(中): 造粒和造粒产品的方法和装置
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申请号: US631249申请日: 1990-12-20
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公开(公告)号: US5100592A公开(公告)日: 1992-03-31
- 发明人: Robert E. Sparks , Norbert Mason , Michael Center
- 申请人: Robert E. Sparks , Norbert Mason , Michael Center
- 申请人地址: MO St. Louis
- 专利权人: Washington University Technology Associated, Inc.
- 当前专利权人: Washington University Technology Associated, Inc.
- 当前专利权人地址: MO St. Louis
- 主分类号: A01N25/12
- IPC分类号: A01N25/12 ; A61K9/16 ; A61K38/00 ; A61P7/00 ; B01J2/00 ; B01J2/14 ; B01J2/28 ; B29B9/08 ; B29B9/10 ; C07C51/43 ; C07C63/06 ; C07C213/10 ; C07C215/60 ; C07C227/42 ; C07C229/60 ; C07C233/25 ; C07D239/42 ; C07K1/00 ; C07K1/107 ; C07K1/113 ; C07K14/00 ; C07K14/195 ; C07K14/41 ; C07K14/52 ; C07K14/53 ; C07K14/535 ; C12N15/09 ; C12N15/27 ; C12P21/02
摘要:
A method of melt granulation for powdery material is disclosed wherein the powdery material is discharged onto the upper surface of a heated rotary spreader for migration under centrifugal force to the periphery of the spreader accompanying by melting of a portion of the material and enrobing of non-melted particles by the melted material for discharge as enlarged granules from the periphery of the spreader. To improve the quality of the granules produced, the feed material is supplied to the spreader at two separate locations. The first location is the central portion of the spreader to provide the melted material and the second location is adjacent to the periphery of the spreader. The spreader is preferably in the form of a concave bowl or inverted truncated cone or dish. Feed material is supplied to the first location by a screw feeder extending down the side of the dish and at the second location by a rotary vaned distributor located within the dish which radially flings the feed material onto the inclined dish wall. The process and apparatus is particularly useful for the production of non-sticky granules which are difficult to form when a single central feed of material is used.
公开/授权文献
- US5683927A Method of forming CMOS integrated circuitry 公开/授权日:1997-11-04
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