发明授权
- 专利标题： Method and structure for repairing electrical lines
- 专利标题（中）： 修复电线的方法和结构
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申请号： US607969申请日： 1990-10-31
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公开(公告)号： US5153408A公开(公告)日： 1992-10-06
- 发明人: Edward F. Handford , Joseph M. Harvilchuck , Mario J. Interrante , Raymond A. Jackson , Raj N. Master , Sudipta K. Ray , William E. Sablinski , Thomas A. Wassick
- 申请人： Edward F. Handford , Joseph M. Harvilchuck , Mario J. Interrante , Raymond A. Jackson , Raj N. Master , Sudipta K. Ray , William E. Sablinski , Thomas A. Wassick
- 申请人地址： NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： NY Armonk
- 主分类号： H01L21/3205
- IPC分类号： H01L21/3205 ; H01L21/768 ; H01L23/498 ; H01L23/52 ; H01L23/525 ; H01L23/538 ; H05K3/00 ; H05K3/02 ; H05K3/22 ; H05K3/34
摘要：
The present invention relates generally to a new method of repairing electrical lines, and more praticularly to repairing electrical lines having an open at the module level with devices in place. Various methods and processes are used to repair this open or defective portion in an electrical conductor line. It could be repaired by securing a jumper wire or nugget across the open or the repair could be made by a deposition process, which includes but is not limited to filling the open with a solder type material or inserting a solder coated electrical wire and heating the solder and allowing the solder to melt and repair the open. One of the attributes of this invention is the ability to repair on a substrate or module on which active components such as chips, and passive components such as pins, capacitors, etc. have been attached. The invention also allows repair of fine line patterns which are normally not repairable by conventional techniques.
公开/授权文献
- US5655918A Selectable ejector for a double-deck PCMCIA eject header 公开/授权日：1997-08-12
信息查询
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