发明授权
US5273938A Method for attaching conductive traces to plural, stacked, encapsulated
semiconductor die using a removable transfer film
失效
使用可移除转移膜将导电迹线附着到多个堆叠的封装的半导体管芯的方法
- 专利标题： Method for attaching conductive traces to plural, stacked, encapsulated semiconductor die using a removable transfer film
- 专利标题（中）： 使用可移除转移膜将导电迹线附着到多个堆叠的封装的半导体管芯的方法
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申请号： US876315申请日： 1992-04-30
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公开(公告)号： US5273938A公开(公告)日： 1993-12-28
- 发明人: Paul T. Lin , Michael B. McShane
- 申请人： Paul T. Lin , Michael B. McShane
- 申请人地址： IL Schaumburg
- 专利权人： Motorola, Inc.
- 当前专利权人： Motorola, Inc.
- 当前专利权人地址： IL Schaumburg
- 优先权： JPX1-1231323 19890906
- 主分类号： H01L21/56
- IPC分类号： H01L21/56 ; H01L21/68 ; H01L23/498 ; H05K3/34 ; H01L21/28 ; H01L21/60 ; H01L21/70
摘要：
A low cost manufacturing method is used to fabricate a small multichip semiconductor device (30). In one embodiment, a pattern of conductive traces (13) is formed on a film of transfer material (12). A first semiconductor die (15) is interconnected to the traces and a resin body (20) is formed around the first die and one side of the traces. The film of transfer material forms, at this stage of the process, one side of the first package. The film of transfer material is then peeled from the pattern of conductive traces and the first resin body to expose the other side of the traces. A second semiconductor die (23) is interconnected to the exposed side of the traces. A second resin body (25) is formed around the second die and portions of the exposed traces. Solder balls (26) are coupled to the exposed portions of the traces to establish external electrical connections to each die.
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