Invention Grant
- Patent Title: Semiconductor device and process of producing the same
- Patent Title (中): 半导体器件及其制造方法
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Application No.: US929918Application Date: 1992-08-17
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Publication No.: US5343353APublication Date: 1994-08-30
- Inventor: Hiroshi Miki , Yuzuru Ohji , Shinichi Tachi , Keiichi Kanehori
- Applicant: Hiroshi Miki , Yuzuru Ohji , Shinichi Tachi , Keiichi Kanehori
- Applicant Address: JPX Tokyo
- Assignee: Hitachi, Ltd.
- Current Assignee: Hitachi, Ltd.
- Current Assignee Address: JPX Tokyo
- Priority: JPX3-216891 19910828
- Main IPC: H01L27/10
- IPC: H01L27/10 ; C23C16/40 ; H01L21/02 ; H01L21/314 ; H01L21/316 ; H01L21/8242 ; H01L21/8246 ; H01L27/105 ; H01L27/108 ; H01G4/10 ; B05D5/12 ; H01G7/00
Abstract:
A microminiature, large capacitor for a semiconductor memory is formed from a raw material compound of plural different kinds of metal atoms for deposition, irrespective of the material, temperature and surface condition of a substrate, thereby forming a thin dielectric film having uniform characteristics not affected by the interface even though the film is made as thin as approximately 0.1 .mu.m. The microminiature large capacitance capacitor has a capacitance unaffected by an oxide existing at the interface between a ferroelectric and electrodes without using precious metals such as platinum having the least degree of freedom in deposition of thin films and microminiature processing. The ferroelectric thin film is deposited using an organic metal comprising a plurality of kinds of metal elements in conformity with the composition of a desired dielectric. As electrodes for use in forming a capacitor, a substance exhibiting conductivity after oxidation is preferably employed.
Public/Granted literature
- US5955038A Ozonizer and method of manufacturing it Public/Granted day:1999-09-21
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