Methods of forming electronic multi-layer printed circuit boards and/or cards and electronic packages including said boards or cards

发明授权

US5473813A Methods of forming electronic multi-layer printed circuit boards and/or cards and electronic packages including said boards or cards 失效

标题翻译：形成电子多层印刷电路板和/或包括所述板或卡的电子封装的方法

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专利标题： Methods of forming electronic multi-layer printed circuit boards and/or cards and electronic packages including said boards or cards
专利标题（中）： 形成电子多层印刷电路板和/或包括所述板或卡的电子封装的方法
申请号： US303711

申请日： 1994-09-09
公开(公告)号： US5473813A

公开(公告)日： 1995-12-12
发明人: Ivan I. Chobot , John A. Covert , Randy L. Haight , Keith D. Mansfield , Donald W. Miller , Reinaldo A. Neira , Alexander Petrovich , Paul C. Sviedrys , Louise A. Tiemann , Gerald A. Valenta , Thurston B. Youngs, Jr.
申请人： Ivan I. Chobot , John A. Covert , Randy L. Haight , Keith D. Mansfield , Donald W. Miller , Reinaldo A. Neira , Alexander Petrovich , Paul C. Sviedrys , Louise A. Tiemann , Gerald A. Valenta , Thurston B. Youngs, Jr.
申请人地址： NY Armonk
专利权人： International Business Machines Corporation
当前专利权人： International Business Machines Corporation
当前专利权人地址： NY Armonk
主分类号： H01L23/12
IPC分类号： H01L23/12 ; H05K1/02 ; H05K1/11 ; H05K3/22 ; H05K3/34 ; H05K3/42 ; H05K3/46 ; H05K3/36

Methods of forming electronic multi-layer printed circuit boards and/or
cards and electronic packages including said boards or cards

摘要：

A method of forming a multi-layer circuit board or card. The method includes the step of forming a plurality of conductive planes. The conductive planes include ground, signal, or power planes. At least one through hole is formed through at least one of the conductive planes. An electrically conductive material is deposited onto an inside surface of the at least one through hole to form a plated through hole. At least one thermal relief passage is formed at least in the at least one of the conductive planes for preventing the diffusion of heat throughout the circuit board or card during the securing or removal or chips or other components to the circuit board or card by heating the material deposited in the at least one through hole to a temperature above its melting point. The at least one thermal relief passage is located in the vicinity of the at least one through hole and is free from electrical connection therewith. An electrically insulating material is deposited on at least one side of each of the conductive planes. The planes are placed on top of each other such that a layer of electrically insulating material is located between each of the conductive planes. The conductive planes are joined together to form the multi-layer circuit board or card.

摘要（中）：

一种形成多层电路板或卡的方法。该方法包括形成多个导电平面的步骤。导电平面包括地面，信号或电力平面。通过至少一个导电平面形成至少一个通孔。将导电材料沉积在所述至少一个通孔的内表面上以形成电镀通孔。至少一个热释放通道至少形成在所述至少一个导电平面中，用于防止在通过加热所述电路板或卡将固定或移除或切屑或其它部件中的热量扩散到整个电路板或卡沉积在至少一个通孔中的材料到高于其熔点的温度。所述至少一个热释放通道位于所述至少一个通孔的附近，并且与所述至少一个通孔没有电连接。电绝缘材料沉积在每个导电平面的至少一侧上。平面被放置在彼此的顶部，使得电绝缘材料层位于每个导电平面之间。导电平面连接在一起以形成多层电路板或卡。

公开/授权文献

US4988987A Keysafe system with timer/calendar features 公开/授权日：1991-01-29

信息查询

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IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L23/00	半导体或其他固态器件的零部件（H01L25/00优先）
H01L23/12	.安装架，例如不可拆卸的绝缘衬底