公开(公告)号：US5473813A

公开(公告)日：1995-12-12

申请号：US303711

申请日：1994-09-09

申请人： Ivan I. Chobot ,  John A. Covert ,  Randy L. Haight ,  Keith D. Mansfield ,  Donald W. Miller ,  Reinaldo A. Neira ,  Alexander Petrovich ,  Paul C. Sviedrys ,  Louise A. Tiemann ,  Gerald A. Valenta ,  Thurston B. Youngs, Jr.

发明人： Ivan I. Chobot ,  John A. Covert ,  Randy L. Haight ,  Keith D. Mansfield ,  Donald W. Miller ,  Reinaldo A. Neira ,  Alexander Petrovich ,  Paul C. Sviedrys ,  Louise A. Tiemann ,  Gerald A. Valenta ,  Thurston B. Youngs, Jr.

IPC分类号： H01L23/12 ,  H05K1/02 ,  H05K1/11 ,  H05K3/22 ,  H05K3/34 ,  H05K3/42 ,  H05K3/46 ,  H05K3/36

CPC分类号： H05K1/0201 ,  H05K1/116 ,  H05K3/3447 ,  H05K2201/062 ,  H05K2201/09309 ,  H05K2201/09454 ,  H05K2201/0969 ,  H05K3/429 ,  Y10T29/49126 ,  Y10T29/49139 ,  Y10T29/49165

摘要： A method of forming a multi-layer circuit board or card. The method includes the step of forming a plurality of conductive planes. The conductive planes include ground, signal, or power planes. At least one through hole is formed through at least one of the conductive planes. An electrically conductive material is deposited onto an inside surface of the at least one through hole to form a plated through hole. At least one thermal relief passage is formed at least in the at least one of the conductive planes for preventing the diffusion of heat throughout the circuit board or card during the securing or removal or chips or other components to the circuit board or card by heating the material deposited in the at least one through hole to a temperature above its melting point. The at least one thermal relief passage is located in the vicinity of the at least one through hole and is free from electrical connection therewith. An electrically insulating material is deposited on at least one side of each of the conductive planes. The planes are placed on top of each other such that a layer of electrically insulating material is located between each of the conductive planes. The conductive planes are joined together to form the multi-layer circuit board or card.

摘要翻译： 一种形成多层电路板或卡的方法。 该方法包括形成多个导电平面的步骤。 导电平面包括地面，信号或电力平面。 通过至少一个导电平面形成至少一个通孔。 将导电材料沉积在所述至少一个通孔的内表面上以形成电镀通孔。 至少一个热释放通道至少形成在所述至少一个导电平面中，用于防止在通过加热所述电路板或卡将固定或移除或切屑或其它部件中的热量扩散到整个电路板或卡 沉积在至少一个通孔中的材料到高于其熔点的温度。 所述至少一个热释放通道位于所述至少一个通孔的附近，并且与所述至少一个通孔没有电连接。 电绝缘材料沉积在每个导电平面的至少一侧上。 平面被放置在彼此的顶部，使得电绝缘材料层位于每个导电平面之间。 导电平面连接在一起以形成多层电路板或卡。

公开(公告)号：US5363280A

公开(公告)日：1994-11-08

申请号：US50589

申请日：1993-04-22

申请人： Ivan I. Chobot ,  John A. Covert ,  Randy L. Haight ,  Keith D. Mansfield ,  Donald W. Miller ,  Reinaldo A. Neira ,  Alexander Petrovich ,  Paul C. Sviedrys ,  Louise A. Tiemann ,  Gerald A. Valenta ,  Thurston B. Youngs, Jr.

发明人： Ivan I. Chobot ,  John A. Covert ,  Randy L. Haight ,  Keith D. Mansfield ,  Donald W. Miller ,  Reinaldo A. Neira ,  Alexander Petrovich ,  Paul C. Sviedrys ,  Louise A. Tiemann ,  Gerald A. Valenta ,  Thurston B. Youngs, Jr.

IPC分类号： H01L23/12 ,  H05K1/02 ,  H05K1/11 ,  H05K3/22 ,  H05K3/34 ,  H05K3/42 ,  H05K3/46 ,  H05K7/20

CPC分类号： H05K1/0201 ,  H05K1/116 ,  H05K3/3447 ,  H05K2201/062 ,  H05K2201/09309 ,  H05K2201/09454 ,  H05K2201/0969 ,  H05K3/429 ,  Y10T29/49126 ,  Y10T29/49139 ,  Y10T29/49165

摘要： A multi-layer printed circuit board or card including at least one passage in at least one of the layers of the circuit board or card for preventing the diffusion of heat throughout the circuit board or card during the securing or removal of components in plated through holes in the circuit board or card by the heating of the plating material to a temperature above a melting point of the plating material.

摘要翻译： 一种多层印刷电路板或卡，其包括在电路板或卡的至少一层中的至少一个通道，用于在固定或移除电镀通孔中的部件时防止热量扩散到整个电路板或卡 在电路板或卡中通过将电镀材料加热至高于电镀材料熔点的温度。