发明授权
- 专利标题: Heat dissipation structure in a portable computer including a heat dissipation block extending from a heat dissipation plate through a first circuit board to a CPU on a second circuit board
- 专利标题(中): 一种便携式计算机中的散热结构,包括从散热板通过第一电路板延伸到第二电路板上的CPU的散热块
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申请号: US728171申请日: 1996-10-09
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公开(公告)号: US5805417A公开(公告)日: 1998-09-08
- 发明人: Tsuyoshi Nakagawa , Yasushi Neho , Naoyuki Sakamoto , Shigeo Ohashi , Yoshito Ohmura , Yukiko Iwama , Tadakatsu Nakajima , Yoshihiro Kondo , Susumu Iwai , Hitoshi Matsushima
- 申请人: Tsuyoshi Nakagawa , Yasushi Neho , Naoyuki Sakamoto , Shigeo Ohashi , Yoshito Ohmura , Yukiko Iwama , Tadakatsu Nakajima , Yoshihiro Kondo , Susumu Iwai , Hitoshi Matsushima
- 申请人地址: JPX Tokyo
- 专利权人: Hitachi, Ltd.
- 当前专利权人: Hitachi, Ltd.
- 当前专利权人地址: JPX Tokyo
- 优先权: JPX7-265148 19951013; JPX7-272173 19951020
- 主分类号: G06F1/20
- IPC分类号: G06F1/20 ; H05K1/02 ; H05K1/14 ; H05K1/18 ; H05K3/36 ; H05K7/20
摘要:
A personal computer comprises a heat dissipation plate installed on a floor of its case, a motherboard disposed apart from the heat dissipation plate by a predetermined distance, and a daughter board disposed in such a manner that the motherboard is positioned between the heat dissipation plate and the daughter board. The daughter board is mounted with a central processing unit which generates heat. The motherboard is provided with a hole. A heat dissipation block extends from the heat dissipation plate through the hole in the motherboard, and is connected to the central processing unit through a heat conductive coupler. This forms a heat dissipation path which passes through the central processing unit, the heat dissipation block, the heat dissipation plate, and the case. In addition, another heat dissipation block is interposed between a keyboard and the daughter board so that another heat dissipation path can be formed through the central processing unit, another heat dissipation block, another heat dissipation plate, and the keyboard. A heat pipe may be connected to a heat dissipation plate.
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