公开(公告)号：US5805417A

公开(公告)日：1998-09-08

申请号：US728171

申请日：1996-10-09

申请人： Tsuyoshi Nakagawa ,  Yasushi Neho ,  Naoyuki Sakamoto ,  Shigeo Ohashi ,  Yoshito Ohmura ,  Yukiko Iwama ,  Tadakatsu Nakajima ,  Yoshihiro Kondo ,  Susumu Iwai ,  Hitoshi Matsushima

发明人： Tsuyoshi Nakagawa ,  Yasushi Neho ,  Naoyuki Sakamoto ,  Shigeo Ohashi ,  Yoshito Ohmura ,  Yukiko Iwama ,  Tadakatsu Nakajima ,  Yoshihiro Kondo ,  Susumu Iwai ,  Hitoshi Matsushima

IPC分类号： G06F1/20 ,  H05K1/02 ,  H05K1/14 ,  H05K1/18 ,  H05K3/36 ,  H05K7/20

CPC分类号： G06F1/203 ,  H05K1/141 ,  H05K1/0203 ,  H05K1/0204 ,  H05K1/182 ,  H05K2201/066 ,  H05K2201/09054 ,  H05K2201/09072 ,  H05K3/368

摘要： A personal computer comprises a heat dissipation plate installed on a floor of its case, a motherboard disposed apart from the heat dissipation plate by a predetermined distance, and a daughter board disposed in such a manner that the motherboard is positioned between the heat dissipation plate and the daughter board. The daughter board is mounted with a central processing unit which generates heat. The motherboard is provided with a hole. A heat dissipation block extends from the heat dissipation plate through the hole in the motherboard, and is connected to the central processing unit through a heat conductive coupler. This forms a heat dissipation path which passes through the central processing unit, the heat dissipation block, the heat dissipation plate, and the case. In addition, another heat dissipation block is interposed between a keyboard and the daughter board so that another heat dissipation path can be formed through the central processing unit, another heat dissipation block, another heat dissipation plate, and the keyboard. A heat pipe may be connected to a heat dissipation plate.

摘要翻译： 个人计算机包括安装在其壳体的地板上的散热板，与散热板隔开预定距离的母板和设置成使得主板位于散热板和 女儿板。 子板安装有产生热量的中央处理单元。 主板上有一个孔。 散热块从散热板延伸穿过主板的孔，并通过导热耦合器连接到中央处理单元。 这形成了通过中央处理单元，散热块，散热板和壳体的散热路径。 此外，在键盘和子板之间插入另一个散热块，从而可以通过中央处理单元，另一个散热块，另一个散热板和键盘形成另一个散热路径。 热管可以连接到散热板。

公开(公告)号：US6094344A

公开(公告)日：2000-07-25

申请号：US433209

申请日：1999-11-04

申请人： Tsuyoshi Nakagawa ,  Yasushi Neho ,  Naoyuki Sakamoto ,  Shigeo Ohashi ,  Yoshito Ohmura ,  Yukiko Iwama ,  Tadakatsu Nakajima ,  Yoshihiro Kondo ,  Susumu Iwai ,  Hitoshi Matsushima

发明人： Tsuyoshi Nakagawa ,  Yasushi Neho ,  Naoyuki Sakamoto ,  Shigeo Ohashi ,  Yoshito Ohmura ,  Yukiko Iwama ,  Tadakatsu Nakajima ,  Yoshihiro Kondo ,  Susumu Iwai ,  Hitoshi Matsushima

IPC分类号： G06F1/20 ,  H05K1/02 ,  H05K1/14 ,  H05K1/18 ,  H05K3/36 ,  H05K7/20

CPC分类号： G06F1/203 ,  H05K1/141 ,  H05K1/0203 ,  H05K1/0204 ,  H05K1/182 ,  H05K2201/066 ,  H05K2201/09054 ,  H05K2201/09072 ,  H05K3/368

摘要： A personal computer including a bottomed case, a keyboard, a top cover forming with said keyboard, an upper face covering said bottomed case, and a heat dissipation structure disposed between the upper face and the bottomed case. The heat dissipation structure includes a printed circuit board having a current consuming device mounted thereon, a first heat dissipation plate disposed under the keyboard, and a first heat conductive block coupled to the first heat dissipation plate and the printed circuit board. The heat conductive block conducts heat generated by the current consuming device to the first heat dissipation plate. The heat dissipation structure further includes a second heat dissipation plate disposed on the bottomed case, and a second heat conductive block coupled to the second heat dissipation plate and the printed board, wherein the second heat conductive block conducts the heat generated by the current consuming device to the second heat dissipation plate.

摘要翻译： 一种个人计算机，包括底壳，键盘，用所述键盘形成的顶盖，覆盖所述有底壳体的上表面，以及设置在所述上​​表面和所述有底壳体之间的散热结构。 散热结构包括其上安装有电流消耗装置的印刷电路板，设置在键盘下方的第一散热板和耦合到第一散热板和印刷电路板的第一导热块。 导热块将由电流消耗装置产生的热量传导到第一散热板。 散热结构还包括设置在有底壳体上的第二散热板和耦合到第二散热板和印刷板的第二导热块，其中第二导热块传导由电流消耗装置产生的热量 到第二散热板。

公开(公告)号：US6094343A

公开(公告)日：2000-07-25

申请号：US145737

申请日：1998-09-02

申请人： Tsuyoshi Nakagawa ,  Yasushi Neho ,  Naoyuki Sakamoto ,  Shigeo Ohashi ,  Yoshito Ohmura ,  Yukiko Iwama ,  Tadakatsu Nakajima ,  Yoshihiro Kondo ,  Susumu Iwai ,  Hitoshi Matsushima

发明人： Tsuyoshi Nakagawa ,  Yasushi Neho ,  Naoyuki Sakamoto ,  Shigeo Ohashi ,  Yoshito Ohmura ,  Yukiko Iwama ,  Tadakatsu Nakajima ,  Yoshihiro Kondo ,  Susumu Iwai ,  Hitoshi Matsushima

IPC分类号： G06F1/20 ,  H05K1/02 ,  H05K1/14 ,  H05K1/18 ,  H05K3/36 ,  H05K7/20

CPC分类号： G06F1/203 ,  H05K1/141 ,  H05K1/0203 ,  H05K1/0204 ,  H05K1/182 ,  H05K2201/066 ,  H05K2201/09054 ,  H05K2201/09072 ,  H05K3/368

摘要： A personal computer comprises a heat dissipation plate installed on a floor of its case, a motherboard disposed apart from the heat dissipation plate by a predetermined distance, and a daughter board disposed in such a manner that the motherboard is positioned between the heat dissipation plate and the daughter board. The daughter board is mounted with a central processing unit which generates heat. The motherboard is provided with a hole. A heat dissipation block extends from the heat dissipation plate through the hole in the motherboard, and is connected to the central processing unit through a heat conductive coupler. This forms a heat dissipation path which passes through the central processing unit, the heat dissipation block, the heat dissipation plate, and the case. In addition, another heat dissipation block is interposed between a keyboard and the daughter board so that another heat dissipation path can be formed through the central processing unit, another heat dissipation block, another heat dissipation plate, and the keyboard.

摘要翻译： 个人计算机包括安装在其壳体的地板上的散热板，与散热板隔开预定距离的母板和设置成使得主板位于散热板和 女儿板。 子板安装有产生热量的中央处理单元。 主板上有一个孔。 散热块从散热板延伸穿过主板的孔，并通过导热耦合器连接到中央处理单元。 这形成了通过中央处理单元，散热块，散热板和壳体的散热路径。 此外，在键盘和子板之间插入另一个散热块，从而可以通过中央处理单元，另一个散热块，另一个散热板和键盘形成另一个散热路径。

公开(公告)号：US06185481B2

公开(公告)日：2001-02-06

申请号：US08969361

申请日：1997-11-28

申请人： Yoshihiro Kondou ,  Tadakatsu Nakajima ,  Shigeo Ohashi ,  Susumu Iwai ,  Masayoshi Miyazaki ,  Shoohei Fuse ,  Kazuo Morita ,  Hidetada Fukunaka

发明人： Yoshihiro Kondou ,  Tadakatsu Nakajima ,  Shigeo Ohashi ,  Susumu Iwai ,  Masayoshi Miyazaki ,  Shoohei Fuse ,  Kazuo Morita ,  Hidetada Fukunaka

IPC分类号： G05B1300

CPC分类号： H05K7/20154 ,  H01L2924/0002 ,  H05K7/2019 ,  H01L2924/00

摘要： A semiconductor device provided with a first cooling fan and heat-radiating fins is mounted on a board, and there is provided a second cooling fan for supplying cooling air to the board, such that a flow passage is formed for directing the cooling air, supplied from the second cooling fan, toward the board through the first cooling fan.

摘要翻译： 设置有第一冷却风扇和散热翅片的半导体装置安装在基板上，并且设置有用于向板供给冷却空气的第二冷却风扇，从而形成用于引导冷却空气的流动通道，供给 从第二个冷却风扇，通过第一个冷却风扇朝向板子。

公开(公告)号：US5796580A

公开(公告)日：1998-08-18

申请号：US226824

申请日：1994-04-13

申请人： Toshihiro Komatsu ,  Hitoshi Matsushima ,  Toshio Hatada ,  Susumu Iwai ,  Tetsuro Homma ,  Yoshihiro Kondo ,  Shouhei Fuse ,  Hiroshi Yamada ,  Kazuo Morita ,  Hiroshi Ito ,  Akiyoshi Iida ,  Kenta Kumagai ,  Shinichi Shimode

发明人： Toshihiro Komatsu ,  Hitoshi Matsushima ,  Toshio Hatada ,  Susumu Iwai ,  Tetsuro Homma ,  Yoshihiro Kondo ,  Shouhei Fuse ,  Hiroshi Yamada ,  Kazuo Morita ,  Hiroshi Ito ,  Akiyoshi Iida ,  Kenta Kumagai ,  Shinichi Shimode

IPC分类号： G06F1/20 ,  H05K7/20 ,  G06F1/16

CPC分类号： H05K7/20727 ,  G06F1/20

摘要： An air-cooled information processing apparatus has a plurality of units and a casing accommodating the units. At least one cooling air supply section and at least one cooling air discharge section are provided in the casing, for supplying cooling air into the apparatus and for discharging the air therefrom. A partition member divides the space inside the casing so as to define at least two cooling air flow channels between the cooling air supply section and the cooling air discharge section. At least one main fan unit is disposed in each of the cooling air flow channels. The cooling air flow channels include at least one first cooling air flow channel in which at least two units from among the plurality of units are disposed in parallel with each other with respect to the direction of flow of cooling air, and at least one second cooling air flow channel in which at least two units from among the plurality of units are arranged in series to each other along the flow of cooling air. This cooling arrangement ensures optimum cooling for different types of units in the apparatus, without being accompanied by rise in the noise level, rate of discharge of air, power consumption and production cost.

摘要翻译： 风冷信息处理装置具有多个单元和容纳该单元的壳体。 至少一个冷却空气供应部分和至少一个冷却空气排放部分设置在壳体中，用于将冷却空气供给到设备中并从中排出空气。 分隔构件将壳体内的空间分隔开，以便在冷却空气供应部分和冷却空气排放部分之间限定至少两个冷却空气流动通道。 至少一个主风扇单元设置在每个冷却空气流动通道中。 冷却空气流动通道包括至少一个第一冷却空气流动通道，其中多个单元中的至少两个单元相对于冷却空气的流动方向彼此平行地设置，并且至少一个第二冷却 空气流动通道，其中来自多个单元中的至少两个单元沿着冷却空气的流动彼此串联布置。 该冷却装置确保了设备中不同类型单元的最佳冷却，而不伴随着噪声水平，空气排放速率，功率消耗和生产成本的上升。

公开(公告)号：US5428503A

公开(公告)日：1995-06-27

申请号：US317614

申请日：1994-09-26

申请人： Hitoshi Matsushima ,  Toshihiro Komatu ,  Yoshihiro Kondou ,  Toshio Hatada ,  Susumu Iwai ,  Tetsuro Honma ,  Toshiki Iino ,  Takao Ohba ,  Akira Yamagiwa

发明人： Hitoshi Matsushima ,  Toshihiro Komatu ,  Yoshihiro Kondou ,  Toshio Hatada ,  Susumu Iwai ,  Tetsuro Honma ,  Toshiki Iino ,  Takao Ohba ,  Akira Yamagiwa

IPC分类号： H05K7/20

CPC分类号： H05K7/20154 ,  Y10S165/908

摘要： A cooling apparatus for electronic equipment for improving the reliability of the equipment by making uniform the temperature distribution of heat generating devices mounted on the electronic equipment, more particularly on a computer and for reducing the working process required at the time of performing a maintenance of a printed circuit board in the electronic equipment by stacking, in a frame, the electronic printed circuit boards on which the heat generating devices, such as a CPU and memories, are mounted at predetermined intervals. The cooling apparatus has a fan fastened to one wall surface of a chamber and a plurality of jet cooling devices formed on the surface opposing the wall surface. The jet cooling devices are formed in parallel to the printed circuit boards. The jet cooling devices are slits, or nozzles or jet stream ducts extending among the printed circuit boards and are so formed as to supply cooling air in a jet stream state to each heat generating device. Therefore, the cooling air can be concentrated to locally cool the printed circuit board including the device that generates heat of a large heating value. Hence, the temperature rise in the heat generating devices can be made uniform.

摘要翻译： 一种用于电子设备的冷却装置，用于通过使安装在电子设备上的发热装置的温度分布均匀，更具体地在计算机上，并且为了减少进行维护时所需的工作过程而提高设备的可靠性 电子设备中的印刷电路板通过在框架中堆叠以预定间隔安装诸如CPU和存储器的发热装置的电子印刷电路板。 冷却装置具有固定在室的一个壁表面上的风扇和形成在与壁表面相对的表面上的多个喷射冷却装置。 喷射冷却装置与印刷电路板平行地形成。 喷射冷却装置是在印刷电路板之间延伸的狭缝或喷嘴或喷射流管道，并且形成为将喷射流状态的冷却空气供应到每个发热装置。 因此，冷却空气可以集中以局部冷却印刷电路板，包括产生大热值的热的装置。 因此，能够使发热元件的温度上升均匀。

公开(公告)号：US5646824A

公开(公告)日：1997-07-08

申请号：US489623

申请日：1995-06-12

申请人： Shigeo Ohashi ,  Toshio Hatada ,  Takeo Tanaka ,  Susumu Iwai

发明人： Shigeo Ohashi ,  Toshio Hatada ,  Takeo Tanaka ,  Susumu Iwai

IPC分类号： F28D15/02 ,  G06F1/20 ,  H01L23/473 ,  H05K7/20

CPC分类号： G06F1/203 ,  F28D15/00 ,  F28D15/0266 ,  H01L23/473 ,  G06F2200/201 ,  H01L2924/0002

摘要： A flat shaped header having a heat receiving side is attached to a semiconductor element mounted on a circuit board. The header having the heat receiving side is connected to another header having a heat receiving side attached to a plurality of heat radiating fins so as to form a heat exchanging radiator which heat radiating fins are installed at a peripheral portion of a body of electronic equipment. The heat generated by the semiconductor element is transmitted by liquid moving between the headers via flexible tubes and then to the heat radiating fins, which heat is discharged outside of the body of equipment. Since the flat shaped header and the flexible tubes are employed, a high heat generating semiconductor element and the heat radiating fins are thermally connected with ease without being influenced by the configurational condition in the equipment even when many semiconductor elements are mounted inside a small space.

摘要翻译： 具有热接收侧的扁平头部安装在安装在电路板上的半导体元件上。 具有热接收侧的集管连接到具有附接到多个散热片的热接收侧的另一个集管，以形成散热片安装在电子设备主体的周边部分的散热片。 由半导体元件产生的热量通过液体通过柔性管在集管之间移动，然后传递到散热片，热量被排放到设备本体外部。 由于使用扁平形的集管和柔性管，因此即使在许多半导体元件安装在小空间内的情况下，高发热半导体元件和散热片也容易热连接而不受设备的结构条件的影响。

公开(公告)号：US5358032A

公开(公告)日：1994-10-25

申请号：US13423

申请日：1993-02-04

申请人： Masatsugu Arai ,  Akiomi Kohno ,  Toshio Hatada ,  Yoshihiro Kondo ,  Toshihiro Komatsu ,  Kanji Otsuka ,  Yuji Shirai ,  Susumu Iwai

发明人： Masatsugu Arai ,  Akiomi Kohno ,  Toshio Hatada ,  Yoshihiro Kondo ,  Toshihiro Komatsu ,  Kanji Otsuka ,  Yuji Shirai ,  Susumu Iwai

IPC分类号： H01L23/36 ,  F28F3/02 ,  H01L23/367 ,  H01L23/467 ,  F28F7/00

CPC分类号： F28F3/022 ,  H01L23/3677 ,  H01L2224/45015 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L24/45 ,  H01L24/49 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/16195

摘要： Disclosed is an LSI package cooling heat sink having a heat diffusion plate and thin wire fins joined to the heat diffusion plate. The heat sink is mounted on an LSI package and the LSI package is cooled by the flowing of fluid through the thin wire fins. The wire fins are made of a net formed of longitudinal thin wires intersecting with horizontal thin wires. The net is formed to continuous rectangular shapes or a swirl shape and joined to the heat diffusion plate. The net is constituted so that the number of the thin wires vertical to the heat diffusion plate is larger than the number of the thin wires parallel thereto and the net is joined to the heat diffusion plate by brazing, diffusion joint, pressure welding or the like. Since the heat sink is formed of the net composed of the longitudinal thin wires intersecting with the horizontal thin wires, the irregular portions of the adjacent thin wires are formed at a dislocated position and fluid striking against the thin wires produces many turbulent flows so that a high heat transfer performance can be obtained. Further, since the net formed of the thin wires is used, the size of cooling fins can be reduced and noise can be also lowered. Further, it is possible to produce an LSI package cooling heat sink in a short time which heat sink is excellent in mass-production.

摘要翻译： 公开了具有热扩散板的LSI封装冷却散热器和与散热板接合的细线散热片。 散热器安装在LSI封装上，并且LSI封装通过流体流过细金属丝散热片来冷却。 金属丝散热片由与水平细线相交的纵向细线形成的网构成。 网形成为连续的矩形形状或漩涡形状并且连接到热扩散板。 网构成为与散热板垂直的细线的数量大于与其平行的细线的数量，并且网通过钎焊，扩散接头，压焊等连接到热扩散板 。 由于散热器由与横向细线相交的纵向细线组成的网形成，所以相邻细线的不规则部分形成在脱位位置，并且撞击细线的流体产生许多湍流，使得 可以获得高的传热性能。 此外，由于使用由细线形成的网，所以能够降低散热片的尺寸，降低噪音。 此外，可以在短时间内制造LSI封装冷却散热器，散热器的批量生产性优异。

公开(公告)号：US6156427A

公开(公告)日：2000-12-05

申请号：US769348

申请日：1991-10-02

申请人： Masao Gotoh ,  Makoto Iida ,  Kenichi Waragai ,  Meiichi Ohta ,  Susumu Iwai

发明人： Masao Gotoh ,  Makoto Iida ,  Kenichi Waragai ,  Meiichi Ohta ,  Susumu Iwai

IPC分类号： B29B9/14 ,  H01B1/22 ,  B32B1/04 ,  H01B1/06

CPC分类号： H01B1/22 ,  B29B9/14 ,  Y10T428/2938 ,  Y10T428/2956 ,  Y10T428/2973 ,  Y10T428/2998

摘要： An electromagnetic wave interference shield structure molded from an electroconductive resin composition for molding, which comprises columnar pellets of a specific length, made of a bundle of iron-based metal fibers as an essential component and at least one bundle of at least another kind of electroconductive fibers of different material in a different diameter than that of the iron-based metal fibers as independent electroconductive fiber-cores, coated with a thermoplastic resin having a specific range of heat distortion temperature continuously in the longitudinal direction has a stable and distinguished shield effect for a prolonged time.

摘要翻译： 由用于成型的导电树脂组合物模制的电磁波干扰屏蔽结构，其包括由一束铁基金属纤维作为主要成分制成的特定长度的柱状颗粒和至少一种至少另一种导电 与作为独立的导电纤维芯的铁基金属纤维的直径不同的不同材料的纤维在长度方向上连续地涂覆有热变形温度特定范围的热塑性树脂具有稳定和显着的屏蔽效果 长时间

公开(公告)号：US20100060889A1

公开(公告)日：2010-03-11

申请号：US12540825

申请日：2009-08-13

申请人： Susumu Iwai ,  Noboru Kato

发明人： Susumu Iwai ,  Noboru Kato

IPC分类号： G01N21/88

CPC分类号： G01N21/896

摘要： A substrate inspection method includes the following steps. Substrates are sequentially moved while an optical system including a light-projecting system and a light-receiving system are moved in a direction orthogonal to the moving direction of each substrate, so as to change the scanned area of each substrate which is scanned with an inspection light having a specific width in the direction orthogonal to the moving direction of the substrate from the light-projecting system; data of the inspected defects of the substrates in the scanned areas are stored for each scanned area; and the stored data of the defects of the substrates in the scanned areas are updated with newly inspected data of the defects of the substrates in the same scanned areas for each substrate, and defect data of one substrate are produced based on the data of the defects of the substrates in a plurality of scanned areas.

摘要翻译： 基板检查方法包括以下步骤。 基板依次移动，同时包括投光系统和光接收系统的光学系统在与每个基板的移动方向正交的方向上移动，以便通过检查来改变扫描的每个基板的扫描区域 光从与投影系统的基板的移动方向正交的方向上具有特定宽度的光; 对于每个扫描区域存储扫描区域中的基板的检查缺陷的数据; 并且利用对每个基板的相同扫描区域中的基板的缺陷的新检查数据更新存储的扫描区域中的基板的缺陷数据，并且基于缺陷的数据产生一个基板的缺陷数据 的多个扫描区域中的基板。