公开(公告)号：US6094344A

公开(公告)日：2000-07-25

申请号：US433209

申请日：1999-11-04

申请人： Tsuyoshi Nakagawa ,  Yasushi Neho ,  Naoyuki Sakamoto ,  Shigeo Ohashi ,  Yoshito Ohmura ,  Yukiko Iwama ,  Tadakatsu Nakajima ,  Yoshihiro Kondo ,  Susumu Iwai ,  Hitoshi Matsushima

发明人： Tsuyoshi Nakagawa ,  Yasushi Neho ,  Naoyuki Sakamoto ,  Shigeo Ohashi ,  Yoshito Ohmura ,  Yukiko Iwama ,  Tadakatsu Nakajima ,  Yoshihiro Kondo ,  Susumu Iwai ,  Hitoshi Matsushima

IPC分类号： G06F1/20 ,  H05K1/02 ,  H05K1/14 ,  H05K1/18 ,  H05K3/36 ,  H05K7/20

CPC分类号： G06F1/203 ,  H05K1/141 ,  H05K1/0203 ,  H05K1/0204 ,  H05K1/182 ,  H05K2201/066 ,  H05K2201/09054 ,  H05K2201/09072 ,  H05K3/368

摘要： A personal computer including a bottomed case, a keyboard, a top cover forming with said keyboard, an upper face covering said bottomed case, and a heat dissipation structure disposed between the upper face and the bottomed case. The heat dissipation structure includes a printed circuit board having a current consuming device mounted thereon, a first heat dissipation plate disposed under the keyboard, and a first heat conductive block coupled to the first heat dissipation plate and the printed circuit board. The heat conductive block conducts heat generated by the current consuming device to the first heat dissipation plate. The heat dissipation structure further includes a second heat dissipation plate disposed on the bottomed case, and a second heat conductive block coupled to the second heat dissipation plate and the printed board, wherein the second heat conductive block conducts the heat generated by the current consuming device to the second heat dissipation plate.

摘要翻译： 一种个人计算机，包括底壳，键盘，用所述键盘形成的顶盖，覆盖所述有底壳体的上表面，以及设置在所述上​​表面和所述有底壳体之间的散热结构。 散热结构包括其上安装有电流消耗装置的印刷电路板，设置在键盘下方的第一散热板和耦合到第一散热板和印刷电路板的第一导热块。 导热块将由电流消耗装置产生的热量传导到第一散热板。 散热结构还包括设置在有底壳体上的第二散热板和耦合到第二散热板和印刷板的第二导热块，其中第二导热块传导由电流消耗装置产生的热量 到第二散热板。

公开(公告)号：US6094343A

公开(公告)日：2000-07-25

申请号：US145737

申请日：1998-09-02

申请人： Tsuyoshi Nakagawa ,  Yasushi Neho ,  Naoyuki Sakamoto ,  Shigeo Ohashi ,  Yoshito Ohmura ,  Yukiko Iwama ,  Tadakatsu Nakajima ,  Yoshihiro Kondo ,  Susumu Iwai ,  Hitoshi Matsushima

发明人： Tsuyoshi Nakagawa ,  Yasushi Neho ,  Naoyuki Sakamoto ,  Shigeo Ohashi ,  Yoshito Ohmura ,  Yukiko Iwama ,  Tadakatsu Nakajima ,  Yoshihiro Kondo ,  Susumu Iwai ,  Hitoshi Matsushima

IPC分类号： G06F1/20 ,  H05K1/02 ,  H05K1/14 ,  H05K1/18 ,  H05K3/36 ,  H05K7/20

CPC分类号： G06F1/203 ,  H05K1/141 ,  H05K1/0203 ,  H05K1/0204 ,  H05K1/182 ,  H05K2201/066 ,  H05K2201/09054 ,  H05K2201/09072 ,  H05K3/368

摘要： A personal computer comprises a heat dissipation plate installed on a floor of its case, a motherboard disposed apart from the heat dissipation plate by a predetermined distance, and a daughter board disposed in such a manner that the motherboard is positioned between the heat dissipation plate and the daughter board. The daughter board is mounted with a central processing unit which generates heat. The motherboard is provided with a hole. A heat dissipation block extends from the heat dissipation plate through the hole in the motherboard, and is connected to the central processing unit through a heat conductive coupler. This forms a heat dissipation path which passes through the central processing unit, the heat dissipation block, the heat dissipation plate, and the case. In addition, another heat dissipation block is interposed between a keyboard and the daughter board so that another heat dissipation path can be formed through the central processing unit, another heat dissipation block, another heat dissipation plate, and the keyboard.

摘要翻译： 个人计算机包括安装在其壳体的地板上的散热板，与散热板隔开预定距离的母板和设置成使得主板位于散热板和 女儿板。 子板安装有产生热量的中央处理单元。 主板上有一个孔。 散热块从散热板延伸穿过主板的孔，并通过导热耦合器连接到中央处理单元。 这形成了通过中央处理单元，散热块，散热板和壳体的散热路径。 此外，在键盘和子板之间插入另一个散热块，从而可以通过中央处理单元，另一个散热块，另一个散热板和键盘形成另一个散热路径。

公开(公告)号：US5805417A

公开(公告)日：1998-09-08

申请号：US728171

申请日：1996-10-09

申请人： Tsuyoshi Nakagawa ,  Yasushi Neho ,  Naoyuki Sakamoto ,  Shigeo Ohashi ,  Yoshito Ohmura ,  Yukiko Iwama ,  Tadakatsu Nakajima ,  Yoshihiro Kondo ,  Susumu Iwai ,  Hitoshi Matsushima

发明人： Tsuyoshi Nakagawa ,  Yasushi Neho ,  Naoyuki Sakamoto ,  Shigeo Ohashi ,  Yoshito Ohmura ,  Yukiko Iwama ,  Tadakatsu Nakajima ,  Yoshihiro Kondo ,  Susumu Iwai ,  Hitoshi Matsushima

IPC分类号： G06F1/20 ,  H05K1/02 ,  H05K1/14 ,  H05K1/18 ,  H05K3/36 ,  H05K7/20

CPC分类号： G06F1/203 ,  H05K1/141 ,  H05K1/0203 ,  H05K1/0204 ,  H05K1/182 ,  H05K2201/066 ,  H05K2201/09054 ,  H05K2201/09072 ,  H05K3/368

摘要： A personal computer comprises a heat dissipation plate installed on a floor of its case, a motherboard disposed apart from the heat dissipation plate by a predetermined distance, and a daughter board disposed in such a manner that the motherboard is positioned between the heat dissipation plate and the daughter board. The daughter board is mounted with a central processing unit which generates heat. The motherboard is provided with a hole. A heat dissipation block extends from the heat dissipation plate through the hole in the motherboard, and is connected to the central processing unit through a heat conductive coupler. This forms a heat dissipation path which passes through the central processing unit, the heat dissipation block, the heat dissipation plate, and the case. In addition, another heat dissipation block is interposed between a keyboard and the daughter board so that another heat dissipation path can be formed through the central processing unit, another heat dissipation block, another heat dissipation plate, and the keyboard. A heat pipe may be connected to a heat dissipation plate.

摘要翻译： 个人计算机包括安装在其壳体的地板上的散热板，与散热板隔开预定距离的母板和设置成使得主板位于散热板和 女儿板。 子板安装有产生热量的中央处理单元。 主板上有一个孔。 散热块从散热板延伸穿过主板的孔，并通过导热耦合器连接到中央处理单元。 这形成了通过中央处理单元，散热块，散热板和壳体的散热路径。 此外，在键盘和子板之间插入另一个散热块，从而可以通过中央处理单元，另一个散热块，另一个散热板和键盘形成另一个散热路径。 热管可以连接到散热板。

公开(公告)号：US5694294A

公开(公告)日：1997-12-02

申请号：US593049

申请日：1996-01-29

申请人： Shigeo Ohashi ,  Tadakatsu Nakajima ,  Yoshihiro Kondo ,  Mitsuru Honma ,  Kenji Onishi ,  Hiroshi Tsuzaki ,  Hitoshi Matsushima

发明人： Shigeo Ohashi ,  Tadakatsu Nakajima ,  Yoshihiro Kondo ,  Mitsuru Honma ,  Kenji Onishi ,  Hiroshi Tsuzaki ,  Hitoshi Matsushima

IPC分类号： G06F1/20 ,  H05K7/20

CPC分类号： G06F1/203

摘要： In a portable personal computer in which high-exothermic devices are mounted within a flat case equipped with an input unit, the and in which a surface temperature of the exothermic devices and the input unit is cooled down to or below a predetermined temperature. A first space is created between the back of a keyboard operating section and an electronic circuit board 3, the electronic circuit board 3 is installed so that the face thereof on which the high-exothermic devices are mounted faces away from the back of the keyboard, a second space is created between the electronic circuit board 3 and an electronic circuit board 2, and a fan 4 is installed inside the case so that cooling air flows from the first space to the second space. A flow path for circulating outside air into the case via an air intake hole 8 is constructed on the wall of the input device operating section.

摘要翻译： 在其中高放热装置安装在配备有输入单元的平坦壳体内并且其中放热装置和输入单元的表面温度被冷却到或低于预定温度的便携式个人计算机中。 在键盘操作部分的背面和电子电路板3之间产生第一空间，电子电路板3被安装成使得其上安装有高放热装置的表面远离键盘的背面， 在电子电路板3和电子电路板2之间产生第二空间，风扇4安装在壳体内部，使得冷却空气从第一空间流到第二空间。 用于经由进气孔8将外部空气循环到壳体中的流动路径被构造在输入装置操作部分的壁上。

公开(公告)号：US06449149B1

公开(公告)日：2002-09-10

申请号：US09057339

申请日：1998-04-09

申请人： Shigeo Ohashi ,  Takashi Naganawa ,  Tadakatsu Nakajima ,  Tsuyoshi Nakagawa ,  Masaaki Eishima ,  Yoshihiro Kondo

发明人： Shigeo Ohashi ,  Takashi Naganawa ,  Tadakatsu Nakajima ,  Tsuyoshi Nakagawa ,  Masaaki Eishima ,  Yoshihiro Kondo

IPC分类号： G06F116

CPC分类号： G06F1/203 ,  G06F2200/203

摘要： An electronic equipment includes a first casing on which are mounted a keyboard and a wiring board and a second casing which is rotatably mounted on the first casing by means of a hinge. The cooling structure of the electronic equipment includes one or more elements that is the subject of cooling arranged within the first casing, a first heat-discharging member thermally connected with this element and the first casing, a second heat-discharging member that is arranged in the interior of the second casing, and connection means for thermally connecting the first heat-discharging element and the second heat-discharging element.

摘要翻译： 电子设备包括：第一壳体，其上安装有键盘和布线板;第二壳体，其通过铰链可旋转地安装在第一壳体上。 电子设备的冷却结构包括作为第一壳体内的冷却对象的一个​​或多个元件，与该元件和第一壳体热连接的第一加热排放构件，第二加热排出构件，其布置在 第二壳体的内部和用于热连接第一散热元件和第二散热元件的连接装置。

公开(公告)号：US06185481B2

公开(公告)日：2001-02-06

申请号：US08969361

申请日：1997-11-28

申请人： Yoshihiro Kondou ,  Tadakatsu Nakajima ,  Shigeo Ohashi ,  Susumu Iwai ,  Masayoshi Miyazaki ,  Shoohei Fuse ,  Kazuo Morita ,  Hidetada Fukunaka

发明人： Yoshihiro Kondou ,  Tadakatsu Nakajima ,  Shigeo Ohashi ,  Susumu Iwai ,  Masayoshi Miyazaki ,  Shoohei Fuse ,  Kazuo Morita ,  Hidetada Fukunaka

IPC分类号： G05B1300

CPC分类号： H05K7/20154 ,  H01L2924/0002 ,  H05K7/2019 ,  H01L2924/00

摘要： A semiconductor device provided with a first cooling fan and heat-radiating fins is mounted on a board, and there is provided a second cooling fan for supplying cooling air to the board, such that a flow passage is formed for directing the cooling air, supplied from the second cooling fan, toward the board through the first cooling fan.

摘要翻译： 设置有第一冷却风扇和散热翅片的半导体装置安装在基板上，并且设置有用于向板供给冷却空气的第二冷却风扇，从而形成用于引导冷却空气的流动通道，供给 从第二个冷却风扇，通过第一个冷却风扇朝向板子。

公开(公告)号：US5365402A

公开(公告)日：1994-11-15

申请号：US800268

申请日：1991-11-29

申请人： Toshio Hatada ,  Shigeo Ohashi ,  Tadakatsu Nakajima ,  Heikichi Kuwahara ,  Hitoshi Matsushima ,  Motohiro Sato ,  Hiroshi Inouye ,  Takao Ohba ,  Akira Yamagiwa ,  Kanji Otsuka ,  Yuuji Shirai

发明人： Toshio Hatada ,  Shigeo Ohashi ,  Tadakatsu Nakajima ,  Heikichi Kuwahara ,  Hitoshi Matsushima ,  Motohiro Sato ,  Hiroshi Inouye ,  Takao Ohba ,  Akira Yamagiwa ,  Kanji Otsuka ,  Yuuji Shirai

IPC分类号： H01L23/36 ,  H01L23/367 ,  H01L23/40 ,  H01L23/433 ,  H05K7/20

CPC分类号： H01L23/433 ,  H01L23/3677 ,  H01L23/4006 ,  H01L2023/405 ,  H01L2224/32188 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/16195

摘要： A cooling apparatus for an electronic device of high calorific density including an elastomer interposed between a semiconductor chip and a heat sink so as to connect them thermally. The elastomer may also be in close contact with a large number of semiconductor chips having various configurations which are mounted on a board, so that the elastomer is thermally connected with them, whereby the elastomer absorbs thermal deformations.

摘要翻译： 一种用于高热密度的电子装置的冷却装置，包括插入在半导体芯片和散热片之间的弹性体，以便将它们热连接。 弹性体还可以与安装在板上的具有各种构造的大量半导体芯片紧密接触，使得弹性体与它们热连接，由此弹性体吸收热变形。

公开(公告)号：US07113404B2

公开(公告)日：2006-09-26

申请号：US10791772

申请日：2004-03-04

申请人： Takashi Naganawa ,  Rintaro Minamitani ,  Shigeo Ohashi ,  Yoshihiro Kondo ,  Osamu Suzuki ,  Hitoshi Matsushima

发明人： Takashi Naganawa ,  Rintaro Minamitani ,  Shigeo Ohashi ,  Yoshihiro Kondo ,  Osamu Suzuki ,  Hitoshi Matsushima

IPC分类号： H05K7/20 ,  H05K1/00 ,  F28F7/00 ,  H01L23/34

CPC分类号： F28F9/002 ,  F28D1/05341 ,  F28F9/0246 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

摘要： A liquid cooling system, comprises: heat-receiving jacket 7, thermally connected with a heat-generation element, a pump attached onto a radiator 1a, and a tank portion 2 on the radiator 1a, wherein a coolant liquid is circulated between the heat-receiving jacket 7 and the radiator 1a by means of the pump 8, thereby obtaining the liquid cooling system for an electronic apparatus, being suitable for small-sizing and a thin-type, while maintaining high reliability thereof.

摘要翻译： 一种液体冷却系统，包括：与发热元件热连接的热接收套7，附接到散热器1a上的泵和在散热器1a上的罐部分2，其中冷却剂液体在 热接收护套7和散热器1a，从而获得用于电子设备的液体冷却系统，适用于小尺寸和薄型，同时保持其高可靠性。

公开(公告)号：US20050088820A1

公开(公告)日：2005-04-28

申请号：US10791772

申请日：2004-03-04

申请人： Takashi Naganawa ,  Rintaro Minamitani ,  Shigeo Ohashi ,  Yoshihiro Kondo ,  Osamu Suzuki ,  Hitoshi Matsushima

发明人： Takashi Naganawa ,  Rintaro Minamitani ,  Shigeo Ohashi ,  Yoshihiro Kondo ,  Osamu Suzuki ,  Hitoshi Matsushima

IPC分类号： F25D17/02 ,  F25D9/00 ,  F28D1/053 ,  F28F9/00 ,  F28F9/04 ,  G06F1/20 ,  H01L23/473 ,  H05K7/20

CPC分类号： F28F9/002 ,  F28D1/05341 ,  F28F9/0246 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

摘要： A liquid cooling system, comprises: heat-receiving jacket 7, thermally connected with a heat-generation element, a pump attached onto a radiator 1a, and a tank portion 2 on the radiator 1a, wherein a coolant liquid is circulated between the heat-receiving jacket 7 and the radiator 1a by means of the pump 8, thereby obtaining the liquid cooling system for an electronic apparatus, being suitable for small-sizing and a thin-type, while maintaining high reliability thereof.

摘要翻译： 一种液体冷却系统，包括：与发热元件热连接的热接收套7，附接到散热器1a上的泵和在散热器1a上的罐部分2，其中冷却剂液体在 热接收护套7和散热器1a，从而获得用于电子设备的液体冷却系统，适用于小尺寸和薄型，同时保持其高可靠性。

公开(公告)号：US06987668B2

公开(公告)日：2006-01-17

申请号：US10847334

申请日：2004-05-18

申请人： Makoto Kitano ,  Takashi Naganawa ,  Yuji Yoshitomi ,  Rintaro Minamitani ,  Shigeo Ohashi ,  Noriyuki Ashiwake ,  Yoshihiro Kondo ,  Tsuyoshi Nakagawa

发明人： Makoto Kitano ,  Takashi Naganawa ,  Yuji Yoshitomi ,  Rintaro Minamitani ,  Shigeo Ohashi ,  Noriyuki Ashiwake ,  Yoshihiro Kondo ,  Tsuyoshi Nakagawa

IPC分类号： G06F1/20

CPC分类号： G06F1/203 ,  G06F2200/201 ,  G06F2200/203

摘要： A liquid cooling system having a circulator for circulating a cooling liquid therethrough including an input portion for receiving the cooling liquid and a separate output portion for supplying the cooling liquid. A heat receiving jacket supplied with the cooling liquid from the circulator and positioned to received heat generated from a heat generation body, a heat radiation portion for radiating heat which is supplied by the cooling liquid passing through the heat receiving jacket, and a member for circulating the cooling liquid passing through the heat radiation portion into the circulation means so that the cooling liquid circulates within a closed flow passage. An accumulating portion is further formed within a portion of the closed flow passage for accumulating the cooling liquid therein.

摘要翻译： 一种液体冷却系统，具有用于循环冷却液的循环器，包括用于接收冷却液的输入部分和用于供应冷却液的单独的输出部分。 供给来自循环器的冷却液的受热套，并且被配置为接收从发热体产生的热量，散热部，其由通过所述受热外套的冷却液供给的散热用的散热部，以及用于循环的部件 冷却液通过散热部分进入循环装置，使得冷却液体在封闭的流动通道内循环。 在封闭流路的一部分内进一步形成蓄积部，用于将冷却液积存在其中。