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发明授权
US5940679A Method of checking electric circuits of semiconductor device and conductive adhesive for checking usage 失效
检查半导体器件电路和导电胶的检查方法

Method of checking electric circuits of semiconductor device and conductive adhesive for checking usage
摘要：
Conductive adhesive for checking electric circuits is formed on contact electrodes of a chip package or a multi-chip module. After contact electrodes of the chip package or the multi-chip module are set on terminal electrodes of a checking device in a correct position, the chip package or the multi-chip module is mounted on the checking device, so that the contact electrodes are electrically connected to the terminal electrodes with the conductive adhesive in-between, and thus the electric circuits of the chip package or the multi-chip module are checked.
摘要（中）：

用于检查电路的导电粘合剂形成在芯片封装或多芯片模块的接触电极上。 在芯片封装或多芯片模块的接触电极设置在正确位置的检查装置的端子电极上之后，芯片封装或多芯片模块安装在检查装置上，使得接触电极电 连接到端子电极，导电粘合剂在其间，从而检查芯片封装或多芯片模块的电路。

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