发明授权
- 专利标题: Heat dissipation structure for a personal computer including two heat dissipation block assemblies and two heat dissipation plates
- 专利标题(中): 包括两个散热块组件和两个散热板的个人计算机的散热结构
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申请号: US433209申请日: 1999-11-04
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公开(公告)号: US6094344A公开(公告)日: 2000-07-25
- 发明人: Tsuyoshi Nakagawa , Yasushi Neho , Naoyuki Sakamoto , Shigeo Ohashi , Yoshito Ohmura , Yukiko Iwama , Tadakatsu Nakajima , Yoshihiro Kondo , Susumu Iwai , Hitoshi Matsushima
- 申请人: Tsuyoshi Nakagawa , Yasushi Neho , Naoyuki Sakamoto , Shigeo Ohashi , Yoshito Ohmura , Yukiko Iwama , Tadakatsu Nakajima , Yoshihiro Kondo , Susumu Iwai , Hitoshi Matsushima
- 申请人地址: JPX Tokyo
- 专利权人: Hitachi, Ltd.
- 当前专利权人: Hitachi, Ltd.
- 当前专利权人地址: JPX Tokyo
- 优先权: JPX7-265148 19951013; JPX7-272173 19951020
- 主分类号: G06F1/20
- IPC分类号: G06F1/20 ; H05K1/02 ; H05K1/14 ; H05K1/18 ; H05K3/36 ; H05K7/20
摘要:
A personal computer including a bottomed case, a keyboard, a top cover forming with said keyboard, an upper face covering said bottomed case, and a heat dissipation structure disposed between the upper face and the bottomed case. The heat dissipation structure includes a printed circuit board having a current consuming device mounted thereon, a first heat dissipation plate disposed under the keyboard, and a first heat conductive block coupled to the first heat dissipation plate and the printed circuit board. The heat conductive block conducts heat generated by the current consuming device to the first heat dissipation plate. The heat dissipation structure further includes a second heat dissipation plate disposed on the bottomed case, and a second heat conductive block coupled to the second heat dissipation plate and the printed board, wherein the second heat conductive block conducts the heat generated by the current consuming device to the second heat dissipation plate.
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