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US6106737A Plasma treatment method utilizing an amplitude-modulated high frequency power 失效
使用调幅高频功率的等离子体处理方法

Plasma treatment method utilizing an amplitude-modulated high frequency
power
摘要:
A plasma treatment method comprising exhausting a process chamber so as to decompress the process chamber, mounting a wafer on a suscepter, supplying a process gas to the wafer through a shower electrode, applying high frequency power, which has a first frequency f.sub.1 lower than an inherent lower ion transit frequencies of the process gas, to the suscepter, and applying high frequency power, which has a second frequency f.sub.2 higher than an inherent upper ion transit frequencies of the process gas, whereby a plasma is generated in the process chamber and activated species influence the wafer.
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