- 专利标题： Wrap-around interconnect for fine pitch ball grid array
-
申请号： US994741申请日： 1997-12-19
-
公开(公告)号： US06121678A公开(公告)日： 2000-09-19
- 发明人: Anthony Chiu , Tom Quoc Lao , Harry Michael Siegel , Michael J. Hundt
- 申请人： Anthony Chiu , Tom Quoc Lao , Harry Michael Siegel , Michael J. Hundt
- 申请人地址： TX Carrollton
- 专利权人： STMicroelectronics, Inc.
- 当前专利权人： STMicroelectronics, Inc.
- 当前专利权人地址： TX Carrollton
- 主分类号： H05K1/11
- IPC分类号： H05K1/11 ; H01L21/301 ; H01L23/12 ; H01L23/14 ; H01L23/498 ; H05K3/00 ; H05K3/34 ; H05K3/40 ; H05K3/42
摘要：
An apparatus and method for producing a wrap-around interconnect substrate (60) comprising a substrate (42) having semi-circular vias (62) having openings (64) created by separating through cylindrical vias (62) that were positioned along cutting lines (46a, 46b) that formed part of an integrated circuit substrate strip (40) prior to separation, is disclosed.
公开/授权文献
- US5364231A Full authority propeller pitch control 公开/授权日：1994-11-15
信息查询
