发明授权
US06348076B1 Slurry for mechanical polishing (CMP) of metals and use thereof
有权
用于金属机械抛光（CMP）的浆料及其用途
- 专利标题： Slurry for mechanical polishing (CMP) of metals and use thereof
- 专利标题（中）： 用于金属机械抛光（CMP）的浆料及其用途
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申请号： US09472961申请日： 1999-12-28
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公开(公告)号： US06348076B1公开(公告)日： 2002-02-19
- 发明人: Donald F. Canaperi , William J. Cote , Paul Feeney , Mahadevaiyer Krishnan , Joyce C. Liu , Michael F. Lofaro , Philip Murphy , Eric Jeffrey White
- 申请人： Donald F. Canaperi , William J. Cote , Paul Feeney , Mahadevaiyer Krishnan , Joyce C. Liu , Michael F. Lofaro , Philip Murphy , Eric Jeffrey White
- 主分类号： C09G102
- IPC分类号： C09G102
摘要：
Slurry compositions comprising an oxidizing agent, copper corrosion inhibitor, abrasive particles; surface active agent and polyelectrolyte are useful for polishing or planarizing chip interconnect/wiring material such as Al, W and especially Cu.
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