- 专利标题： Epoxy resin compositions and premolded semiconductor packages
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申请号： US09988752申请日： 2001-11-20
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公开(公告)号： US06569532B2公开(公告)日： 2003-05-27
- 发明人: Kazutoshi Tomiyoshi , Kazuhiro Arai , Toshio Shiobara , Koki Oitori , Hironori Sakamoto , Yuji Kishigami , Koji Tsuchiya , Masato Kanari
- 申请人： Kazutoshi Tomiyoshi , Kazuhiro Arai , Toshio Shiobara , Koki Oitori , Hironori Sakamoto , Yuji Kishigami , Koji Tsuchiya , Masato Kanari
- 优先权： JP11-342946 19991202; JP2000-360597 20001128
- 主分类号： B32B2738
- IPC分类号： B32B2738
摘要：
In an epoxy resin composition comprising an epoxy resin, a curing agent, and an inorganic filler, the filler is porous silica having a specific surface area of 6-200 m2/g, a true specific gravity of 2.0-2.2, and a mean particle size of 2-50 &mgr;m. The epoxy resin composition is readily moldable, has a low moisture permeability and reliability in the cured state, and is suitable for forming a premolded hollow semiconductor package.
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