摘要:
In an epoxy resin composition comprising an epoxy resin, a curing agent, and an inorganic filler, the filler is porous silica having a specific surface area of 6-200 m2/g, a true specific gravity of 2.0-2.2, and a mean particle size of 2-50 &mgr;m. The epoxy resin composition is readily moldable, has a low moisture permeability and reliability in the cured state, and is suitable for forming a premolded hollow semiconductor package.
摘要:
In a support apparatus for analysis and design of a semiconductor device, a function indicating an impurity concentration distribution in a channel region of a first transistor in a depth direction is set. A structure data indicating a structure of a transistor device and a measurement value of each of electric characteristics of the transistor are related. A Poisson's equation, which is express by using the function, is solved by using a depletion layer width as a variable to calculate a surface potential, and a first calculation value of the electric characteristic of the first transistor is calculated by using the surface potential. A determining section determines the function to indicate the impurity concentration distribution of a first transistor when a measurement value corresponding to a first structure data which indicates a structure of the first transistor, and the first calculation value are substantially coincident with each other.
摘要:
In a support apparatus for analysis and design of a semiconductor device, a function indicating an impurity concentration distribution in a channel region of a first transistor in a depth direction is set. A structure data indicating a structure of a transistor device and a measurement value of each of electric characteristics of the transistor are related. A Poisson's equation, which is express by using the function, is solved by using a depletion layer width as a variable to calculate a surface potential, and a first calculation value of the electric characteristic of the first transistor is calculated by using the surface potential. A determining section determines the function to indicate the impurity concentration distribution of a first transistor when a measurement value corresponding to a first structure data which indicates a structure of the first transistor, and the first calculation value are substantially coincident with each other, and stores the function in the storage section. The above operations are repeated until the first calculation value and the measurement value are substantially coincident with each other.
摘要:
In a method of extracting parameters of a diffusion model from object parameters to be used in a process simulation of a semiconductor manufacturing process, classifying the object parameters into a first through an N-th (N being a natural integer not smaller than 2) groups, the first group being used for classifying thereinto the most fundamental physical and least model-dependent parameters, the N-th group being used for classifying thereinto the least fundamental physical and most model-dependent parameters, and extracting successively the classified parameters in the first through the N-th groups in the order from the first to the N-th group.
摘要:
From the data of diffusion-length-dependent parameters extracted from the parameters of the transistor model of MOS transistors and from the parameters of transistors having various diffusion lengths, a diffusion-length-dependent parameter correcting unit creates approximate expressions of the diffusion length dependence of these parameters, and calculates parameter correction values to be used instead of original parameter values by using the created approximate expressions. Hence, the correction values can be used easily instead of the original parameter values, whereby a transistor model of MOS transistors having a different diffusion length DL can be created easily. Circuit simulation in consideration of the diffusion length dependence of the drain currents of MOS transistors can thus be carried out, whereby highly accurate simulation can be attained.
摘要:
A feed-forward amplifier and a controller thereof. Two types of second pilot signals, sum frequency and difference frequency of a base pilot signal and a local oscillation signal, are generated by an injection-side mixer and injected into a distortion detection loop. Part of a signal appearing at an output terminal is branched, converted in frequency by a detection-side mixer using the local oscillation signal, filtered by a narrow-band filter, input to a synchronizing detector with the filtered output of the filter as error signals, and synchronizing detected with reference to the base pilot signal so as to generate control signals for a distortion rejection loop. The spectrums of the second pilot signals may be spread. A process to cancel the input signal component at the detection side may be performed. A simple circuit configuration enhances the distortion component rejection and suppression effect and shortens the time required until an optimum control state is established.
摘要:
A circuit for biasing an FET, comparing a gate bias voltage of the FET with a reference voltage at an operational amplifier and performing closed-loop control on the gate bias voltage of the FET with the output of the operational amplifier. The temperature characteristics of the mutual conductance of the FET is compensated by setting the temperature characteristics of one or both of two voltage dividing resistors. Variations in a drain bias current due to input signal level and temperature changes can be suppressed. The circuit at the gate and the circuit at the drain are separate, making possible class A, class AB, and class B operations. The voltage drop at the gate resistor can be ignored so that the gate resistor can be designed with priority given to stability of the RF characteristics.
摘要:
In a method of accurately determining an area that has been changed to an amorphous state which uses a computer simulation of a semiconductor manufacturing process, the impurity concentration at the crystalline-amorphous boundary is taken as the parameter C. The value obtained by dividing the implanted ion concentration obtained by means of an ion implantation simulator by the parameter Ca is defined as the amorphous conversion ratio parameter, and a region in which this amorphous conversion ratio parameter is 1 or greater is taken to be an area that is converted to an amorphous state.
摘要:
A control circuit for an automatically controlled feed forward nonlinear distortion compensation amplifier. The control circuit controls a distortion detection loop and a distortion removal loop. The distortion detection loop is a loop for feeding forward input to a main amplifier into a first directional coupler. The distortion removal loop is a loop for feeding forward distortion elements into a second directional coupler. The main amplifier is preceded by a variable attenuator and a variable phase shifter. A variable attenuator and a variable phase shifter are also located in a feed forward path to the second directional coupler. The control circuit controls the variable attenuator and the variable phase shifter preceding the main amplifier for detecting the distortion elements. The control circuit controls the variable attenuator and the variable phase shifter located in the feed forward path to the second directional coupler for removing the distortion elements. A temperature compensation signal and an adjustment signal are added to a control signal by each adder provided at the output stage of the control circuit.
摘要:
A design supporting apparatus of a semiconductor device, includes sections to perform: setting an impurity concentration with respect to a channel direction and a depth direction to node points arranged discretely in a channel region of a model transistor based on a predetermined concentration distribution rule; calculating an electric characteristic of the model transistor by using the impurity concentration; and storing the impurity concentration as a model parameter of the model transistor in a storage unit, when the calculated electric characteristic and an electric characteristic prepared previously are coincident with each other within a predetermined range. The device characteristic calculating section calculates a surface potential to each of the node points by reducing a dimension of the impurity concentration in the depth direction, corrects the surface potential based on interaction between the node points adjacent to each other, and calculates the electric characteristic by using the corrected surface potential.