公开(公告)号：US06569532B2

公开(公告)日：2003-05-27

申请号：US09988752

申请日：2001-11-20

申请人： Kazutoshi Tomiyoshi ,  Kazuhiro Arai ,  Toshio Shiobara ,  Koki Oitori ,  Hironori Sakamoto ,  Yuji Kishigami ,  Koji Tsuchiya ,  Masato Kanari

发明人： Kazutoshi Tomiyoshi ,  Kazuhiro Arai ,  Toshio Shiobara ,  Koki Oitori ,  Hironori Sakamoto ,  Yuji Kishigami ,  Koji Tsuchiya ,  Masato Kanari

IPC分类号： B32B2738

CPC分类号： H01L23/295 ,  C08K3/36 ,  H01L23/08 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/48247 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01067 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/3025 ,  Y10T428/25 ,  Y10T428/259 ,  Y10T428/26 ,  Y10T428/31511 ,  C08L63/00 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： In an epoxy resin composition comprising an epoxy resin, a curing agent, and an inorganic filler, the filler is porous silica having a specific surface area of 6-200 m2/g, a true specific gravity of 2.0-2.2, and a mean particle size of 2-50 &mgr;m. The epoxy resin composition is readily moldable, has a low moisture permeability and reliability in the cured state, and is suitable for forming a premolded hollow semiconductor package.

公开(公告)号：US20110089548A1

公开(公告)日：2011-04-21

申请号：US12953499

申请日：2010-11-24

申请人： YOSHIHIKO SHIMANUKI ,  Yoshihiro Suzuki ,  Koji Tsuchiya

发明人： YOSHIHIKO SHIMANUKI ,  Yoshihiro Suzuki ,  Koji Tsuchiya

IPC分类号： H01L23/495

CPC分类号： H01L24/97 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/49548 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/32014 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10162 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/351 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

摘要： There are constituted by a tab (1b) on which a semiconductor chip (2) is mounted, a sealing portion (3) formed by resin-sealing the semiconductor chip (2), a plurality of leads (1a) each having a mounted surface (1d) exposed to a peripheral portion of a rear surface (3a) of the sealing portion (3) and a sealing-portion forming surface (1g) disposed on an opposite side thereto, and a wire (4) for connecting a pad (2a) of the semiconductor chip (2) and a lead (1a), wherein the length (M) between inner ends (1h) of the sealing-portion forming surfaces (1g) of the leads (1a) disposed so as to oppose to each other is formed to be larger than the length (L) between inner ends (1h) of the mounted surfaces (1d). Thereby, a chip mounting region surrounded by the inner end (1h) of the sealing-portion forming surface (1g) of each lead (1a) can be expanded and the size of the mountable chip is increased.

摘要翻译： 由安装有半导体芯片（2）的突片（1b），通过树脂密封半导体芯片（2）形成的密封部分（3），多个引线（1a），其具有安装表面 （1d）暴露于密封部分（3）的后表面（3a）的周边部分和设置在其相对侧上的密封部分形成表面（1g）和用于连接焊盘（4）的焊丝（4） 2a）和引线（1a）之间的长度（M），其中引线（1a）的密封部分形成表面（1g）的内端（1h）之间的长度（M）设置为与 彼此形成为大于安装面（1d）的内端（1h）之间的长度（L）。 由此，可以扩大由每个引线（1a）的密封部形成面（1g）的内端（1h）包围的芯片安装区域，并且可安装芯片的尺寸增大。

公开(公告)号：US07843049B2

公开(公告)日：2010-11-30

申请号：US12408890

申请日：2009-03-23

申请人： Yoshihiko Shimanuki ,  Yoshihiro Suzuki ,  Koji Tsuchiya

发明人： Yoshihiko Shimanuki ,  Yoshihiro Suzuki ,  Koji Tsuchiya

IPC分类号： H01L23/02

CPC分类号： H01L24/97 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/49548 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/32014 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10162 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/351 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

摘要： There are constituted by a tab (1b) on which a semiconductor chip (2) is mounted, a sealing portion (3) formed by resin-sealing the semiconductor chip (2), a plurality of leads (1a) each having a mounted surface (1d) exposed to a peripheral portion of a rear surface (3a) of the sealing portion (3) and a sealing-portion forming surface (1g) disposed on an opposite side thereto, and a wire (4) for connecting a pad (2a) of the semiconductor chip (2) and a lead (1a), wherein the length (M) between inner ends (1h) of the sealing-portion forming surfaces (1g) of the leads (1a) disposed so as to oppose to each other is formed to be larger than the length (L) between inner ends (1h) of the mounted surfaces (1d). Thereby, a chip mounting region surrounded by the inner end (1h) of the sealing-portion forming surface (1g) of each lead (1a) can be expanded and the size of the mountable chip is increased.

摘要翻译： 由安装有半导体芯片（2）的突片（1b），通过树脂密封半导体芯片（2）形成的密封部分（3），多个引线（1a），其具有安装表面 （1d）暴露于密封部分（3）的后表面（3a）的周边部分和设置在其相对侧上的密封部分形成表面（1g）和用于连接焊盘（4）的焊丝（4） 2a）和引线（1a）之间的长度（M），其中引线（1a）的密封部分形成表面（1g）的内端（1h）之间的长度（M）设置为与 彼此形成为大于安装面（1d）的内端（1h）之间的长度（L）。 由此，可以扩大由每个引线（1a）的密封部形成面（1g）的内端（1h）包围的芯片安装区域，并且可安装芯片的尺寸增大。

公开(公告)号：US20050212116A1

公开(公告)日：2005-09-29

申请号：US11038070

申请日：2005-01-21

申请人： Yoshihiko Shimanuki ,  Koji Tsuchiya

发明人： Yoshihiko Shimanuki ,  Koji Tsuchiya

IPC分类号： H01L23/29 ,  H01L21/60 ,  H01L23/14 ,  H01L23/31 ,  H01L23/48 ,  H01L23/495 ,  H01L23/50 ,  H01L23/52

CPC分类号： H01L23/3107 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49565 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor device which permits reduction in the number of pins and in size thereof is provided. The semiconductor device comprises a sealing body formed of an insulating resin, the sealing body having an upper surface, a lower surface opposite to the upper surface, and side faces which connect the upper and lower surfaces with each other; an electrically conductive tab sealed within the sealing body; tab suspending leads contiguous to the tab and partially exposed to the lower surface and the side faces of the sealing body; a semiconductor chip fixed to a lower surface of the tab; a plurality of electrically conductive leads, the electrically conductive leads each having an inner end portion positioned within the sealing body, an outer end portion exposed to the lower surface and a side face of the sealing body, and a projecting portion projecting into the sealing body from a side face of each of the electrically conductive leads; a projecting portion projecting from a side face of each of the tab suspending leads and positioned within the sealing body; and electrically conductive wires positioned within the sealing body and connecting electrodes formed on a lower surface of the semiconductor chip with the projecting portions of the electrically conductive leads and the tab suspending leads.

摘要翻译： 提供了允许减少引脚数和尺寸的半导体器件。 半导体器件包括由绝缘树脂形成的密封体，密封体具有上表面，与上表面相对的下表面和将上下表面相互连接的侧面; 密封在密封体内的导电片; 突片悬挂引线邻接突片并且部分地暴露于密封体的下表面和侧面; 固定在突片的下表面的半导体芯片; 多个导电引线，所述导电引线各自具有位于所述密封体内的内端部，暴露于所述下表面的外端部和所述密封体的侧面，以及突出部，所述突出部突出到所述密封体 从每个导电引线的侧面; 突出部分，其从每个突片悬挂引线的侧面突出并定位在密封体内; 以及定位在密封体内的导电线和形成在半导体芯片的下表面上的电极与导电引线和突片悬挂引线的突出部分。

公开(公告)号：US06478679B1

公开(公告)日：2002-11-12

申请号：US09269973

申请日：1999-07-21

申请人： Atsunori Himoto ,  Kenji Tosaki ,  Madoka Nakayama ,  Miyuki Yasuoka ,  Koji Tsuchiya

发明人： Atsunori Himoto ,  Kenji Tosaki ,  Madoka Nakayama ,  Miyuki Yasuoka ,  Koji Tsuchiya

IPC分类号： A63F1302

CPC分类号： A63F13/95 ,  A63F13/12 ,  A63F13/215 ,  A63F13/26 ,  A63F13/92 ,  A63F2300/204 ,  A63F2300/206 ,  A63F2300/402 ,  A63F2300/403 ,  A63F2300/408 ,  A63F2300/636 ,  A63F2300/65 ,  A63F2300/8029

摘要： A memory device has a small-sized LCD disposed on an upper part of the front side of a case, and operation buttons disposed below the LCD. An external connection terminal for connecting a game apparatus or others to an outside apparatus is disposed in the lower side of the case nearer the front side thereof. A controller has a card slot for the memory device to be loaded in, which is provided in an upper part of an operation side thereof. The card slot has a window opened so as to expose a required part of the memory device when the memory device is loaded in the controller. With the memory device loaded in the controller a game player operates the operation buttons while watching the LCD of the memory device.

公开(公告)号：US5566558A

公开(公告)日：1996-10-22

申请号：US511933

申请日：1995-08-07

申请人： Koji Tsuchiya

发明人： Koji Tsuchiya

IPC分类号： D04B15/88 ,  D04B35/10 ,  D04B35/34

CPC分类号： D04B35/10 ,  D04B15/88 ,  D04B35/34

摘要： A circular knitting machine and take-up mechanism therefor includes a knitting unit for forming a tubular knit fabric, a first set of let-off rolls for flattening the tubular fabric into a double-layer web and delivering the web from the knitting unit, a slitter for slitting the flattened tubular fabric longitudinally along a predetermined line, a spreader for spreading the slit fabric into a single layer web, the spreader being extendable and contractible to spread fabrics of varying widths, a second set of let-off rolls for drawing the fabric across the spreader and a fabric take-up for taking-up the single layer web for storage and subsequent use.

摘要翻译： 一种圆形针织机及其卷绕机构包括：用于形成管状针织物的编织单元，将第一组送出辊用于将管状织物平坦化成双层织物并将织物从针织单元输送， 用于沿着预定线纵向切割扁平扁平管状织物的分切机，用于将狭缝织物铺展成单层织物的撒布机，撒布机可伸缩收缩以展开各种宽度的织物，第二组送出辊用于拉伸 织物穿过吊具和织物卷取，用于卷起单层纤维网进行存储和后续使用。

公开(公告)号：US5381676A

公开(公告)日：1995-01-17

申请号：US128807

申请日：1993-09-29

申请人： Takao Shibata ,  Kozo Taniguchi ,  Tashio Noguchi ,  Koji Tsuchiya

发明人： Takao Shibata ,  Kozo Taniguchi ,  Tashio Noguchi ,  Koji Tsuchiya

IPC分类号： D04B15/88

CPC分类号： D04B15/88

摘要： A fabric take-up apparatus for a circular knitting machine includes a set of delivery rolls for flattening and delivering the flattened fabric to take-up means which winds the flattened fabric into a roll, sensing means for sensing the tension in the fabric and for generating electrical signals indicative of fluctuations in tension from a predetermined, desired tension in the fabric, variable speed drive means for driving the delivery rolls, and control means for controlling the variable speed drive means responsive to the electrical signals generated by the tension sensing means.

摘要翻译： 用于圆形针织机的织物卷取装置包括一组输送辊，用于使扁平织物平整并输送到将扁平织物卷成卷的卷取装置，用于感测织物中的张力的感测装置和用于产生 指示织物中预定的期望张力的张力波动的电信号，用于驱动输送辊的变速驱动装置，以及响应于张力检测装置产生的电信号来控制变速驱动装置的控制装置。

公开(公告)号：US4565076A

公开(公告)日：1986-01-21

申请号：US661102

申请日：1984-10-15

申请人： Koji Tsuchiya

发明人： Koji Tsuchiya

IPC分类号： D04B15/94 ,  D04B15/88 ,  D04B35/10

CPC分类号： D04B35/10 ,  D04B15/88

摘要： A single safety device to automatically stop a conventional circular knitting machine in the event of failure of the belt used to drive a pair of fabric advancing rollers of the machine while the fabric is being knit, and/or to stop the machine in the event of failure to secure the so-advanced fabric to the rotary shaft upon which the fabric is normally rolled to sequentially form individual rolls of fabric on the machine.

摘要翻译： 一种单一的安全装置，用于在织物被编织时在用于驱动机器的一对织物推进辊的皮带发生故障的情况下自动停止传统的圆形针织机，和/或在发生织物的情况下停止机器 未能将如此先进的织物固定到旋转轴上，织物通常在该旋转轴上顺序地在机器上形成单个的织物卷。

公开(公告)号：US08711280B2

公开(公告)日：2014-04-29

申请号：US13530746

申请日：2012-06-22

申请人： Hiroki Hagiwara ,  Keiji Sasano ,  Hiroaki Tanaka ,  Yuki Tuji ,  Tsuyoshi Watanabe ,  Koji Tsuchiya ,  Kenzo Tanaka ,  Takaya Wada ,  Noboru Kawabata ,  Hirokazu Yoshida ,  Hironori Yokoyama

发明人： Hiroki Hagiwara ,  Keiji Sasano ,  Hiroaki Tanaka ,  Yuki Tuji ,  Tsuyoshi Watanabe ,  Koji Tsuchiya ,  Kenzo Tanaka ,  Takaya Wada ,  Noboru Kawabata ,  Hirokazu Yoshida ,  Hironori Yokoyama

IPC分类号： H04N5/225 ,  H01L21/00

CPC分类号： H01L27/14634 ,  H01L27/14618 ,  H01L27/14636 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H04N5/2253 ,  H04N5/369 ,  H05K1/0206 ,  H05K1/0207 ,  H05K2201/10121 ,  H01L2924/00014 ,  H01L2924/00

摘要： A solid-state image sensing apparatus includes a solid-state image sensing device, signal processing circuit device, and a multi-layer wiring package. The solid-state image sensing device has a pixel in an image sensing area thereof. The pixel receives incident light and generate a signal electric charge. The signal processing circuit device is arranged to face the image sensing area and applies signal processing to a signal output from the solid-state image sensing device. The multi-layer wiring package has wiring layers, the solid-state image sensing device, and the signal processing circuit device. Each of the wiring layers is laminated via an insulator. The multi-layer wiring package is formed such that a first wiring layer provided between the solid-state image sensing device and the signal processing circuit device has a greater thickness than second wiring layers and has heat conductivity higher than or equal to heat conductivity of the second wiring layers.

摘要翻译： 固体摄像装置包括固体摄像装置，信号处理电路装置以及多层布线包装体。 固态图像感测装置在其图像感测区域中具有像素。 像素接收入射光并产生信号电荷。 信号处理电路装置被配置为面对图像感测区域，并且对从固态图像感测装置输出的信号进行信号处理。 多层布线封装具有布线层，固态图像感测装置和信号处理电路装置。 每个布线层通过绝缘体层叠。 多层布线封装被形成为使得设置在固态图像感测装置和信号处理电路装置之间的第一布线层具有比第二布线层更大的厚度，并且导热率高于或等于 第二布线层。

公开(公告)号：US08390133B2

公开(公告)日：2013-03-05

申请号：US13534078

申请日：2012-06-27

申请人： Yoshihiko Shimanuki ,  Yoshihiro Suzuki ,  Koji Tsuchiya

发明人： Yoshihiko Shimanuki ,  Yoshihiro Suzuki ,  Koji Tsuchiya

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L24/97 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/49548 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/32014 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10162 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/351 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

摘要： There are constituted by a tab on which a semiconductor chip is mounted, a sealing portion formed by resin-sealing the semiconductor chip, a plurality of leads each having a mounted surface exposed to a peripheral portion of a rear surface of the sealing portion and a sealing-portion forming surface disposed on an opposite side thereto, and a wire for connecting a pad of the semiconductor chip and a lead, wherein the length between inner ends of the sealing-portion forming surfaces of the leads disposed so as to oppose to each other is formed to be larger than the length between inner ends of the mounted surfaces. Thereby, a chip mounting region surrounded by the inner end of the sealing-portion forming surface of each lead can be expanded and the size of the mountable chip is increased.

摘要翻译： 由安装半导体芯片的突片，通过树脂密封半导体芯片形成的密封部分，多个引线，每个引线具有暴露于密封部分的后表面的周边部分的安装表面，以及 密封部分形成表面设置在其相对侧上，以及导线，用于连接半导体芯片的焊盘和引线，其中引线的密封部分形成表面的内端之间的长度设置为与每个 另一个形成为大于安装表面的内端之间的长度。 由此，能够扩大由各引线的密封部形成面的内端包围的芯片安装区域，能够增大安装芯片的尺寸。