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公开(公告)号:US06569532B2
公开(公告)日:2003-05-27
申请号:US09988752
申请日:2001-11-20
申请人: Kazutoshi Tomiyoshi , Kazuhiro Arai , Toshio Shiobara , Koki Oitori , Hironori Sakamoto , Yuji Kishigami , Koji Tsuchiya , Masato Kanari
发明人: Kazutoshi Tomiyoshi , Kazuhiro Arai , Toshio Shiobara , Koki Oitori , Hironori Sakamoto , Yuji Kishigami , Koji Tsuchiya , Masato Kanari
IPC分类号: B32B2738
CPC分类号: H01L23/295 , C08K3/36 , H01L23/08 , H01L24/48 , H01L2224/05599 , H01L2224/48247 , H01L2224/85399 , H01L2924/00014 , H01L2924/01012 , H01L2924/01019 , H01L2924/0102 , H01L2924/01067 , H01L2924/12042 , H01L2924/15153 , H01L2924/15165 , H01L2924/16195 , H01L2924/181 , H01L2924/3025 , Y10T428/25 , Y10T428/259 , Y10T428/26 , Y10T428/31511 , C08L63/00 , H01L2924/00 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要: In an epoxy resin composition comprising an epoxy resin, a curing agent, and an inorganic filler, the filler is porous silica having a specific surface area of 6-200 m2/g, a true specific gravity of 2.0-2.2, and a mean particle size of 2-50 &mgr;m. The epoxy resin composition is readily moldable, has a low moisture permeability and reliability in the cured state, and is suitable for forming a premolded hollow semiconductor package.