发明授权
- 专利标题： Electronic device and its manufacturing method
- 专利标题（中）： 电子器件及其制造方法
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申请号： US09698055申请日： 2000-10-30
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公开(公告)号： US06756670B1公开(公告)日： 2004-06-29
- 发明人: Shunpei Yamazaki , Mitsunori Tsuchiya , Kazuo Urata , Itaru Koyama , Shinji Imatou , Shigenori Hayashi , Naoki Hirose , Mari Sasaki , Noriya Ishida , Kouhei Wada
- 申请人： Shunpei Yamazaki , Mitsunori Tsuchiya , Kazuo Urata , Itaru Koyama , Shinji Imatou , Shigenori Hayashi , Naoki Hirose , Mari Sasaki , Noriya Ishida , Kouhei Wada
- 优先权： JP63-212885 19880826; JP63-261961 19881017; JP63-261962 19881017
- 主分类号： H01L2306
- IPC分类号： H01L2306
摘要：
An electronic device comprising a substrate having a frame, a metal lead and an electronic parts in a bonding structure, and a molding of an organic resin formed on the substrate, wherein the surface of the organic resin is provided with a hardened water-resistant or carbonaceous film or wherein pores at the surface of the organic resin are filled within an inactive gas such as argon because of a plasma treatment of the resin surface with the inactive gas whereby impurities are prevented from entering into the organic resin through the pores.
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