公开(公告)号：US06756670B1

公开(公告)日：2004-06-29

申请号：US09698055

申请日：2000-10-30

申请人： Shunpei Yamazaki ,  Mitsunori Tsuchiya ,  Kazuo Urata ,  Itaru Koyama ,  Shinji Imatou ,  Shigenori Hayashi ,  Naoki Hirose ,  Mari Sasaki ,  Noriya Ishida ,  Kouhei Wada

发明人： Shunpei Yamazaki ,  Mitsunori Tsuchiya ,  Kazuo Urata ,  Itaru Koyama ,  Shinji Imatou ,  Shigenori Hayashi ,  Naoki Hirose ,  Mari Sasaki ,  Noriya Ishida ,  Kouhei Wada

IPC分类号： H01L2306

CPC分类号： H01L23/49586 ,  H01L21/56 ,  H01L23/29 ,  H01L23/3135 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48463 ,  H01L2224/8592 ,  H01L2924/01007 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/05442 ,  H01L2924/05042 ,  H01L2924/00012

摘要： An electronic device comprising a substrate having a frame, a metal lead and an electronic parts in a bonding structure, and a molding of an organic resin formed on the substrate, wherein the surface of the organic resin is provided with a hardened water-resistant or carbonaceous film or wherein pores at the surface of the organic resin are filled within an inactive gas such as argon because of a plasma treatment of the resin surface with the inactive gas whereby impurities are prevented from entering into the organic resin through the pores.

摘要翻译： 一种电子设备，包括具有框架，金属引线和接合结构中的电子部件的基板，以及在所述基板上形成的有机树脂的模制件，其中所述有机树脂的表面设置有硬化防水或 碳质膜或其中有机树脂表面的孔被填充在惰性气体如氩气中，因为用惰性气体等离子体处理树脂表面，从而防止杂质通过孔进入有机树脂。

公开(公告)号：US06191492B1

公开(公告)日：2001-02-20

申请号：US08161859

申请日：1993-12-06

申请人： Shunpei Yamazaki ,  Mitsunori Tsuchiya ,  Kazuo Urata ,  Itaru Koyama ,  Shinji Imatou ,  Shigenori Hayashi ,  Naoki Hirose ,  Mari Sasaki ,  Noriya Ishida ,  Kouhei Wada

发明人： Shunpei Yamazaki ,  Mitsunori Tsuchiya ,  Kazuo Urata ,  Itaru Koyama ,  Shinji Imatou ,  Shigenori Hayashi ,  Naoki Hirose ,  Mari Sasaki ,  Noriya Ishida ,  Kouhei Wada

IPC分类号： H01L2328

CPC分类号： H01L24/48 ,  H01L23/3135 ,  H01L23/49586 ,  H01L24/45 ,  H01L2224/05624 ,  H01L2224/29339 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48624 ,  H01L2224/8592 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/05042 ,  H01L2924/00 ,  H01L2924/00012

摘要： An electronic device comprising a substrate having a frame, a metal lead and an electronic parts in a bonding structure, and a molding of an organic resin formed on the substrate, wherein the surface of the organic resin is provided with a hardened water-resistant or carbonaceous film or wherein pores at the surface of the organic resin are filled within an inactive gas such as argon because of a plasma treatment of the resin surface with the inactive gas whereby impurities are prevented from entering into the organic resin through the pores.

摘要翻译： 一种电子设备，包括具有框架，金属引线和接合结构中的电子部件的基板，以及在所述基板上形成的有机树脂的模制件，其中所述有机树脂的表面设置有硬化防水或 碳质膜或其中有机树脂表面的孔被填充在惰性气体如氩气中，因为用惰性气体等离子体处理树脂表面，从而防止杂质通过孔进入有机树脂。

公开(公告)号：US5147822A

公开(公告)日：1992-09-15

申请号：US667231

申请日：1991-02-25

申请人： Shunpei Yamazaki ,  Mitsunori Tsuchiya ,  Kazuo Urata ,  Itaru Koyama ,  Shinji Imatou ,  Shigenori Hayashi ,  Naoki Hirose ,  Mari Sasaki ,  Noriya Ishida ,  Kouhei Wada

发明人： Shunpei Yamazaki ,  Mitsunori Tsuchiya ,  Kazuo Urata ,  Itaru Koyama ,  Shinji Imatou ,  Shigenori Hayashi ,  Naoki Hirose ,  Mari Sasaki ,  Noriya Ishida ,  Kouhei Wada

IPC分类号： H01L21/56 ,  H01L23/29 ,  H01L23/31 ,  H01L23/495

CPC分类号： H01L23/49586 ,  H01L21/56 ,  H01L23/29 ,  H01L23/3135 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/01007 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/181

摘要： An electronic device comprising a substrate having a frame, a metal lead and electronic parts in a bonding structure, and a molding of an organic resin formed on the substrate, wherein the surface of the organic resin is provided with a hardened water-resistant or carbonaceous film.

摘要翻译： 一种电子设备，包括具有框架，金属引线和接合结构中的电子部件的基板，以及在所述基板上形成的有机树脂的模制品，其中所述有机树脂的表面设置有硬化的耐水或含碳的 电影。

公开(公告)号：US20100190530A1

公开(公告)日：2010-07-29

申请号：US12667346

申请日：2008-06-05

申请人： Kouhei Wada ,  Kimiaki Imai

发明人： Kouhei Wada ,  Kimiaki Imai

IPC分类号： H04B1/38 ,  H05K5/00 ,  H04M1/00

CPC分类号： H04M1/0266 ,  G06F1/1616 ,  G06F1/1637 ,  G06F1/1681 ,  H04M1/0214

摘要： In a foldable portable terminal, a display device 6 is contained in a first housing 2. The display device 6 includes a display panel 4 that is longer in a lateral direction, and a driver 5 for driving the display panel 4. A pair of first hinge bearing portions 2a are respectively formed at lower right and left ends of the first housing 2 so as to protrude beyond the front surface of the first housing 2 with respect to the display panel 4. An operation section 8 is contained in a second housing 3, and a pair of second hinge bearing portions 3a are formed at an upper end of the second housing 3 so as to protrude horizontally between the first hinge bearing portions 3a. An open/close shaft is disposed in each of right and left pairs of the first hinge bearing portion 2a and the second hinge bearing portion 3a which are rotatably coupled with each other, in order to foldably connect the first housing 2 and the second housing 3 to each other. Thus, the lateral centerline Y of the display panel 4 is aligned with the lateral centerline of the first housing 2 while minimizing an increase in size of the first housing 2 due to the alignment.

摘要翻译： 在可折叠便携式终端中，显示装置6被容纳在第一壳体2中。显示装置6包括在横向方向上较长的显示面板4和用于驱动显示面板4的驱动器5.一对第一 铰链轴承部分2a分别形成在第一壳体2的右下端和左端，以相对于显示面板4突出超出第一壳体2的前表面。操作部分8容纳在第二壳体3中 并且一对第二铰链轴承部分3a形成在第二壳体3的上端，以便在第一铰链轴承部分3a之间水平突出。 为了可折叠地连接第一壳体2和第二壳体3，第一铰链轴承部分2a和第二铰链轴承部分3a中的每对左右对中的开/关轴彼此可旋转地联接 对彼此。 因此，显示面板4的横向中心线Y与第一壳体2的横向中心线对齐，同时最小化由于对准而导致的第一壳体2的尺寸的增加。