发明授权
- 专利标题： Semiconductor device and lead frame therefor
- 专利标题（中）： 半导体器件及其引线框架
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申请号： US10136409申请日： 2002-05-02
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公开(公告)号： US06844219B2公开(公告)日： 2005-01-18
- 发明人: Makoto Kitano , Akihiro Yaguchi , Naotaka Tanaka , Takeshi Terasaki , Ichiro Anjoh , Ryo Haruta , Asao Nishimura , Junichi Saeki
- 申请人： Makoto Kitano , Akihiro Yaguchi , Naotaka Tanaka , Takeshi Terasaki , Ichiro Anjoh , Ryo Haruta , Asao Nishimura , Junichi Saeki
- 申请人地址： JP Tokyo
- 专利权人： Renesas Technology Corp.
- 当前专利权人： Renesas Technology Corp.
- 当前专利权人地址： JP Tokyo
- 代理机构： Antonelli, Terry, Stout & Kraus, LLP
- 优先权： JP8-309566 19961120
- 主分类号： H01L23/12
- IPC分类号： H01L23/12 ; H01L21/60 ; H01L23/00 ; H01L23/02 ; H01L23/16 ; H01L23/31 ; H01L23/488 ; H01L23/495 ; H01L23/498 ; H05K3/34 ; H01L21/44
摘要：
A semiconductor device which can improve the connection reliability of solder bumps and productivity in manufacturing. Insulating tape having wiring patterns on its surface is bonded to a lead frame. Semiconductor elements are loaded and circuit formed surfaces and sides of the semiconductor elements are sealed with sealing resin. After arrangements of individual semiconductor devices are formed, the lead frame is separated into individual metal plates to form individual semiconductor devices. Such simultaneous production of a plurality of semiconductor devices enhances productivity, and improves flatness of the insulating tape, whereby the connection reliability of solder bumps is improved.
公开/授权文献
- US20020135051A1 Semiconductor device and lead frame therefor 公开/授权日：2002-09-26
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