发明授权
- 专利标题: Cerium oxide abrasive and method of polishing substrates
- 专利标题(中): 氧化铈磨料和抛光底物的方法
-
申请号: US09782241申请日: 2001-02-13
-
公开(公告)号: US06863700B2公开(公告)日: 2005-03-08
- 发明人: Masato Yoshida , Toranosuke Ashizawa , Hiroki Terazaki , Yasushi Kurata , Jun Matsuzawa , Kiyohito Tanno , Yuuto Ootuki
- 申请人: Masato Yoshida , Toranosuke Ashizawa , Hiroki Terazaki , Yasushi Kurata , Jun Matsuzawa , Kiyohito Tanno , Yuuto Ootuki
- 申请人地址: JP Tokyo
- 专利权人: Hitachi Chemical Company, Ltd.
- 当前专利权人: Hitachi Chemical Company, Ltd.
- 当前专利权人地址: JP Tokyo
- 代理机构: Griffin & Szipl, P.C.
- 优先权: JP08-258766 19960930; JP08-258767 19960930; JP08-258768 19960930; JP08-258770 19960930; JP08-258774 19960930; JP08-258775 19960930; JP08-258776 19960930; JP08-258781 19960930; JP08-259138 19960930; JP09-014371 19970128; JP09-112396 19970430; JP09-207866 19970801
- 主分类号: C09C1/68
- IPC分类号: C09C1/68 ; C09G1/02 ; C09K3/14 ; H01L21/304 ; H01L21/3105 ; H01L21/321 ; C09G1/04 ; B24B1/00
摘要:
A cerium oxide abrasive slurry having, dispersed in a medium, cerium oxide particles whose primary particles have a median diameter of from 30 nm to 250 nm, a maximum particle diameter of 600 nm or smaller, and a specific surface area of from 7 to 45 m2/g, and slurry particles have a median diameter of from 150 nm to 600 nm. The cerium oxide particles have structural parameter Y, representing an isotropic microstrain obtained by an X-ray Rietvelt method (with RIETAN-94), of from 0.01 to 0.70, and structural parameter X, representing a primary particle diameter obtained by an X-ray Rietvelt method (with RIETAN-94), of from 0.08 to 0.3. The cerium oxide abrasive slurry is made by a method of obtaining particles by firing at a temperature of from 600° C. to 900° C. and then pulverizing, then dispersing the resulting cerium oxide particles in a medium.
公开/授权文献
- US20020069593A1 Cerium Oxide abrasive and method of polishing substrates 公开/授权日:2002-06-13