发明授权
- 专利标题： Method of making a lead-free integrated circuit package
- 专利标题（中）： 制造无铅集成电路封装的方法
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申请号： US09817330申请日： 2001-03-26
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公开(公告)号： US06889429B2公开(公告)日： 2005-05-10
- 发明人: Phillip C. Celaya , James S. Donley , Stephen C. St. Germain
- 申请人： Phillip C. Celaya , James S. Donley , Stephen C. St. Germain
- 申请人地址： US AZ Phoenix
- 专利权人： Semiconductor Components Industries, L.L.C.
- 当前专利权人： Semiconductor Components Industries, L.L.C.
- 当前专利权人地址： US AZ Phoenix
- 代理商 James J. StiPanuk; Kevin B. Jackson
- 主分类号： H01L23/14
- IPC分类号： H01L23/14 ; H01L23/498 ; H05K3/24 ; H05K3/34
摘要：
An integrated circuit package (60) has a substrate (12) with a first surface (51) for mounting a semiconductor die (20) and a second surface (52) defining a via (70). A lead (26) is formed by plating a conductive material to project outwardly from the second surface. The conductive material extends from the lead through the first via for coupling to the semiconductor die.
公开/授权文献
- US20020134582A1 Integrated circuit package and method 公开/授权日：2002-09-26
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