发明授权
- 专利标题： Semiconductor encapsulating epoxy resin composition and semiconductor device
- 专利标题（中）： 半导体封装环氧树脂组合物和半导体器件
-
申请号： US09883276申请日： 2001-06-19
-
公开(公告)号： US06894091B2公开(公告)日： 2005-05-17
- 发明人: Shoichi Osada , Toshio Shiobara , Eiichi Asano , Kazutoshi Tomiyoshi , Takayuki Aoki , Shigeki Ino
- 申请人： Shoichi Osada , Toshio Shiobara , Eiichi Asano , Kazutoshi Tomiyoshi , Takayuki Aoki , Shigeki Ino
- 申请人地址： JP Tokyo
- 专利权人： Shin Etsu Chemical Co., Ltd.
- 当前专利权人： Shin Etsu Chemical Co., Ltd.
- 当前专利权人地址： JP Tokyo
- 代理机构： Birch, Stewart, Kolasch & Birch, LLP.
- 优先权： JP2000-183054 20000619
- 主分类号： C08K3/00
- IPC分类号： C08K3/00 ; C08G59/28 ; C08G59/62 ; C08K9/02 ; C08L63/00 ; H01L23/29 ; H01L23/31 ; C08K5/00
摘要：
A semiconductor encapsulating epoxy resin composition comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) a molybdenum compound, and (D) 300-900 parts by weight per 100 parts by weight of components (A) and (B) combined of an inorganic filler contains nitrogen atoms in an amount of 1.5-20% by weight based on the weight of components (A) and (B) combined. Cured parts of the composition exhibit high-temperature capabilities and flame retardance despite the absence of halogenated epoxy resins and antimony trioxide.