发明授权
US06902824B2 Copper foil and metal foil with carrier foil for printed wiring board, and semi-additive process for producing printed wiring board using the same
失效
用于印刷线路板的铜箔和带有载体箔的金属箔，以及用于制造使用其的印刷线路板的半添加工艺
- 专利标题： Copper foil and metal foil with carrier foil for printed wiring board, and semi-additive process for producing printed wiring board using the same
- 专利标题（中）： 用于印刷线路板的铜箔和带有载体箔的金属箔，以及用于制造使用其的印刷线路板的半添加工艺
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申请号： US10059222申请日： 2002-01-31
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公开(公告)号： US06902824B2公开(公告)日： 2005-06-07
- 发明人: Takuya Yamamoto , Takashi Kataoka , Yutaka Hirasawa , Naotomi Takahashi
- 申请人： Takuya Yamamoto , Takashi Kataoka , Yutaka Hirasawa , Naotomi Takahashi
- 申请人地址： JP Tokyo
- 专利权人： Mitsui Mining & Smelting Co., Ltd.
- 当前专利权人： Mitsui Mining & Smelting Co., Ltd.
- 当前专利权人地址： JP Tokyo
- 代理机构： Rothwell, Figg, Ernst & Manbeck, P.C.
- 主分类号： H05K1/09
- IPC分类号： H05K1/09 ; C23F1/00 ; C23F1/28 ; C25D3/12 ; C25D3/30 ; C25D3/38 ; C25D5/02 ; C25D5/34 ; C25D7/00 ; C25D7/06 ; H05K3/02 ; H05K3/10 ; H05K3/18 ; H05K3/24 ; H05K3/38 ; B32B7/12
摘要：
This invention provides a metal foil and an etching process which overcomes the problem of etching of the copper foil layer and the plating copper layer formed on a metal clad laminate during the conventional semi-additive process for producing printed wire boards. In the present invention, the metal foil and the metal foil with carrier foil include a nickel or tin layer 0.5 to 3 μm thick formed on the external surface of a metal clad laminate which protects the surface of the plated layer during the final flash etching of the copper foil layer.
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