公开(公告)号：US06716572B2

公开(公告)日：2004-04-06

申请号：US10082154

申请日：2002-02-26

申请人： Takuya Yamamoto ,  Takashi Kataoka ,  Yutaka Hirasawa ,  Naotomi Takahashi

发明人： Takuya Yamamoto ,  Takashi Kataoka ,  Yutaka Hirasawa ,  Naotomi Takahashi

IPC分类号： G03F700

CPC分类号： H05K3/0038 ,  H05K3/0035 ,  H05K3/4652 ,  H05K2201/0112 ,  H05K2201/0347 ,  H05K2203/0361 ,  H05K2203/1388 ,  Y10S430/146 ,  Y10T29/49165

摘要： It is an object to provide a manufacturing process for a printed wiring board in which a copper foil and resin as a substrate material of a copper clad laminate are irradiated with carbon dioxide gas laser light to drill in both of them simultaneously. In forming a through hole or a hole such as IVH, BVH or the like in the copper clad laminate using carbon dioxide gas laser light, one of a nickel layer of 0.08 to 2 &mgr;m in thickness, a cobalt layer of 0.05 to 3 &mgr;m in thickness and a zinc layer of 0.03 to 2 &mgr;m in thickness is formed as an additional metal layer on a surface of the copper foil residing in an external layer of the copper clad laminate and thereafter, by performing laser drilling, the copper foil layer and the resin layer as a substrate material of the copper clad laminate are enabled to drill simultaneously.

摘要翻译： 本发明的目的是提供一种印刷线路板的制造方法，其中铜箔和作为覆铜层压板的基板材料的树脂被二氧化碳气体激光照射以同时钻孔。 在使用二氧化碳气体激光的覆铜层压板中形成IVH，BVH等通孔或孔，在0.08〜2μm厚的镍层中，将0.05〜3μm的钴层 在覆铜层压板的外层的铜箔的表面上形成厚度为0.03〜2μm的锌层作为附加金属层，然后通过进行激光打孔，将铜箔层和 作为覆铜层压板的基材的树脂层能够同时钻孔。

公开(公告)号：US06902824B2

公开(公告)日：2005-06-07

申请号：US10059222

申请日：2002-01-31

申请人： Takuya Yamamoto ,  Takashi Kataoka ,  Yutaka Hirasawa ,  Naotomi Takahashi

发明人： Takuya Yamamoto ,  Takashi Kataoka ,  Yutaka Hirasawa ,  Naotomi Takahashi

IPC分类号： H05K1/09 ,  C23F1/00 ,  C23F1/28 ,  C25D3/12 ,  C25D3/30 ,  C25D3/38 ,  C25D5/02 ,  C25D5/34 ,  C25D7/00 ,  C25D7/06 ,  H05K3/02 ,  H05K3/10 ,  H05K3/18 ,  H05K3/24 ,  H05K3/38 ,  B32B7/12

CPC分类号： H05K3/025 ,  H05K3/108 ,  H05K3/384 ,  H05K2201/0355 ,  H05K2203/0307 ,  H05K2203/0723 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T428/12028 ,  Y10T428/12438 ,  Y10T428/12493 ,  Y10T428/12646 ,  Y10T428/12715 ,  Y10T428/1291 ,  Y10T428/12944 ,  Y10T428/265 ,  Y10T428/2839

摘要： This invention provides a metal foil and an etching process which overcomes the problem of etching of the copper foil layer and the plating copper layer formed on a metal clad laminate during the conventional semi-additive process for producing printed wire boards. In the present invention, the metal foil and the metal foil with carrier foil include a nickel or tin layer 0.5 to 3 μm thick formed on the external surface of a metal clad laminate which protects the surface of the plated layer during the final flash etching of the copper foil layer.

摘要翻译： 本发明提供一种金属箔和蚀刻工艺，其克服了在用于生产印刷线路板的常规半添加工艺中铜箔层和形成在覆金属层压板上的电镀铜层的蚀刻问题。 在本发明中，金属箔和具有载体箔的金属箔包括形成在金属覆层层叠体的外表面上的0.5至3μm厚的镍或锡层，其在最终闪光蚀刻期间保护镀层的表面 铜箔层。

公开(公告)号：US06660406B2

公开(公告)日：2003-12-09

申请号：US09885552

申请日：2001-06-20

申请人： Takuya Yamamoto ,  Takashi Kataoka ,  Naotomi Takahashi

发明人： Takuya Yamamoto ,  Takashi Kataoka ,  Naotomi Takahashi

IPC分类号： B21C3700

CPC分类号： H05K3/20 ,  H05K1/167 ,  H05K3/025 ,  H05K3/384 ,  H05K2203/0152 ,  H05K2203/0307 ,  H05K2203/1572 ,  Y10T428/12438 ,  Y10T428/12493 ,  Y10T428/1291 ,  Y10T428/24917

摘要： There are provided an electrodeposited copper foil with carrier that can be used for manufacturing a printed wiring board that excels in the finished accuracy of the resistor circuit in comparison with a conventional printed wiring board with resistor circuits, and a method for manufacturing such a printed wiring board with resistor circuits. The method for manufacturing a printed wiring board with resistor circuits comprises the steps of previously forming copper foil circuits using a copper foil for a printed wiring board with resistor circuits comprising a nickel layer for forming a resistor circuit between a copper carrier and a copper foil layer for forming the circuit, whose surface layer is subjected to a nodular treatment, using a copper etching solution that does not etch the nickel layer; fabricating a copper clad laminate using the copper foil after forming the copper circuits, and a prepreg composing a resin base material; removing the copper carrier to expose the nickel layer for forming the resistor circuit, and etching the resistor circuits to form the nickel resistor-circuits.

公开(公告)号：US06605369B1

公开(公告)日：2003-08-12

申请号：US09913775

申请日：2001-08-14

申请人： Naotomi Takahashi ,  Yutaka Hirasawa

发明人： Naotomi Takahashi ,  Yutaka Hirasawa

IPC分类号： B32B1504

CPC分类号： H05K3/384 ,  C25D5/10 ,  C25D5/48 ,  C25D11/38 ,  H05K3/389 ,  H05K2201/0355 ,  H05K2203/0307 ,  H05K2203/0723 ,  Y10S428/901 ,  Y10T428/12014 ,  Y10T428/12514 ,  Y10T428/12549 ,  Y10T428/12674 ,  Y10T428/12792 ,  Y10T428/12903 ,  Y10T428/1291 ,  Y10T428/31663 ,  Y10T428/31692

摘要： The present invention is directed to provision of a surface-treated copper foil exhibiting a maximum effect of a silane coupling agent which is adsorbed onto the copper foil and is employed in order to enhance adhesion between the copper foil and a substrate during manufacture of printed wiring boards. The invention is also directed to provision of a method for producing such a copper foil. To attain these goals, a surface-treated copper foil for producing printed wiring boards is provided, wherein an anti-corrosion treatment comprises forming a zinc layer or a zinc alloy layer on a surface of the copper foil and forming an electrodeposited chromate layer on the zinc or zinc alloy layer; forming a silane-coupling-agent-adsorbed layer on the electrodeposited chromate layer without causing the electrodeposited chromate layer of the nodular-treated surface to dry; and drying.

摘要翻译： 本发明涉及提供一种表面处理铜箔，其表现出吸附在铜箔上的硅烷偶联剂的最大效果，并且用于在印刷布线的制造过程中增强铜箔与基材之间的粘合性 董事会 本发明还涉及提供这种铜箔的制造方法。 为了实现这些目的，提供了一种用于制造印刷线路板的表面处理铜箔，其中防腐蚀处理包括在铜箔的表面上形成锌层或锌合金层，并在其上形成电沉积的铬酸盐层 锌或锌合金层; 在电沉积的铬酸盐层上形成硅烷偶联剂吸附层，而不会使结晶处理表面的电沉积铬酸盐层干燥; 并干燥。

公开(公告)号：US06479170B2

公开(公告)日：2002-11-12

申请号：US09755772

申请日：2001-01-05

申请人： Naotomi Takahashi ,  Yutaka Hirasawa

发明人： Naotomi Takahashi ,  Yutaka Hirasawa

IPC分类号： B32B1520

CPC分类号： G01N3/32 ,  C22F1/08 ,  C25D1/04 ,  G01N33/20 ,  G01N2203/0023 ,  G01N2203/0226 ,  G01N2203/0282 ,  H05K1/09 ,  H05K2201/0355 ,  Y10S428/935 ,  Y10T428/12431 ,  Y10T428/12438 ,  Y10T428/12903

摘要： The present invention provides an electrodeposited copper foil which solves problems of electrodeposited-copper-clad laminates to which the foil has been incorporated, such as bow, twist, and poor dimensional stability, and a method of inspecting an electrodeposited copper foil so as to assure the quality of the foil. In the invention, there is employed an electrodeposited copper foil which recrystallizes by heating at low temperature during production of a copper-clad laminate employing an electrodeposited copper foil and which exhibits an elongation as high as 18% or more in an atmosphere of 180° C., wherein the maximum rate of decrease in maximum tensile strength falls within the aging time ranging from 5 to 10 minutes in a process in which tensile strength decreases as time elapses during aging in an atmosphere at 170° C., and the change in tensile strength in a knick portion shown in a {tensile strength} vs. {aging time} curve which is drawn in an x-y plane and which has a knick portion is 3 kg/mm2 or more, the x-axis representing aging time and the y-axis representing tensile strength.

摘要翻译： 本发明提供一种电解铜箔，其解决了结合有箔的电沉积铜包覆层压板的问题，例如弯曲，扭曲和尺寸稳定性差，以及检查电沉积铜箔的方法，以确保 箔的质量。 在本发明中，使用电沉积铜箔，其在使用电沉积铜箔的覆铜层压板的制造中在低温下加热而再结晶，并且在180℃的气氛中表现出高达18％以上的伸长率 其中，最大拉伸强度的最大降低速率在拉伸强度在170℃的气氛中老化时的时间经过时拉伸强度降低的过程中在5〜10分钟的老化时间内，拉伸变化 在xy平面中绘制并且具有克点部分的{拉伸强度}对{老化时间}曲线所示的细纱部分的强度为3kg / mm 2或更大，x轴表示老化时间和y -axis表示拉伸强度。

公开(公告)号：US06616827B2

公开(公告)日：2003-09-09

申请号：US09838321

申请日：2001-04-20

申请人： Kazuyoshi Nabekura ,  Yutaka Hirasawa ,  Naotomi Takahashi

发明人： Kazuyoshi Nabekura ,  Yutaka Hirasawa ,  Naotomi Takahashi

IPC分类号： C25D2118

CPC分类号： B01D37/02

摘要： The present invention provides a filtration method of copper electrolyte that can remove minute electrolytic by-products and dirt and may improve filtration efficiency by improving a conventional filtration method, the so-called precoating method. In a filtration method of copper electrolyte for removing electrolytic by-products and dirt which affect copper electrolysis, by passing copper electrolyte through a filter element precoated with a filtering aid, in the present invention, a precoated layer of a filtering aid is formed on a filter element in advance. Activated carbon preliminary treatment solution containing powdery activated carbon is passed through the filter element formed with the precoated layer, and is also circulated until no powdery activated carbon leaks from an outlet of the filter element, thus forming a powdery activated carbon layer on the precoated layer. Subsequently, the copper electrolyte is passed through for filtration.

摘要翻译： 本发明提供了一种铜电解质的过滤方法，其可以通过改进所谓的预涂法的常规过滤方法来去除微小的电解副产物和污垢并且可以提高过滤效率。 在用于除去影响铜电解的电解副产物和污垢的铜电解质的过滤方法中，通过使铜电解质通过预过滤助剂的过滤元件通过，在本发明中，过滤助剂的预涂层形成在 过滤元件。 含有粉末状活性炭的活性炭预处理溶液通过由预涂层形成的过滤元件，并且循环，直到粉状活性炭从过滤元件的出口泄漏出来，从而在预涂层上形成粉状活性炭层 。 随后，使铜电解液通过以进行过滤。

公开(公告)号：US06533915B2

公开(公告)日：2003-03-18

申请号：US09769253

申请日：2001-01-26

申请人： Masakazu Mitsuhashi ,  Takashi Kataoka ,  Naotomi Takahashi

发明人： Masakazu Mitsuhashi ,  Takashi Kataoka ,  Naotomi Takahashi

IPC分类号： C25D510

CPC分类号： H05K3/384 ,  C23C28/00 ,  C23C2222/20 ,  C25D1/04 ,  C25D3/565 ,  C25D5/16 ,  C25D5/48 ,  C25D11/38 ,  H05K3/389 ,  H05K2201/0355 ,  H05K2203/0307 ,  H05K2203/0723 ,  H05K2203/1105 ,  Y10T428/12431

摘要： The invention provides a surface-treated copper foil for producing printed wiring boards whose surface has,,been subjected to nodular treatment and anti-corrosion treatment, wherein the anti-corrosion treatment includes forming a-zinc-copper-tin ternary alloy anti-corrosive plating layer on a surface of the copper foil; forming an electrolytic chromate layer on the anti-corrosive plating layer; forming a silane-coupling-agent-adsorbed layer on the electrolytic chromate layer; and drying the copper foil for 2-6 seconds such that the copper foil reaches 105° C.-200° C.

摘要翻译： 本发明提供一种表面处理铜箔，用于制造表面经过结块处理和防腐处理的印刷线路板，其中防腐处理包括形成锌 - 铜 - 锡三元合金防腐蚀 铜箔表面上的镀层; 在所述防腐镀层上形成电解铬酸盐层; 在电解铬酸盐层上形成硅烷偶联剂吸附层; 并将铜箔干燥2-6秒，使铜箔达到105℃-200℃。

公开(公告)号：US06579437B2

公开(公告)日：2003-06-17

申请号：US09769251

申请日：2001-01-26

申请人： Masakazu Mitsuhashi ,  Takashi Kataoka ,  Naotomi Takahashi

发明人： Masakazu Mitsuhashi ,  Takashi Kataoka ,  Naotomi Takahashi

IPC分类号： C25D550

CPC分类号： C25D1/04 ,  C23C28/00 ,  C25D3/565 ,  C25D5/16 ,  C25D5/48 ,  H05K3/384 ,  H05K3/389 ,  H05K2201/0355 ,  H05K2203/0307 ,  H05K2203/0723 ,  H05K2203/1105 ,  Y10T428/12431 ,  Y10T428/12549 ,  Y10T428/12569

摘要： An object of the invention is to provide a surface-treated copper foil capable of consistently attaining a percent loss in peel strength against hydrochloric acid degradation of 10% or less as measured on a copper pattern prepared from the copper foil and having a line width of 0.2 mm, by bringing out the maximum effect of the silane coupling agent employed in zinc-plated or zinc-alloy-plated anti-corrosive copper foil. Another object is to impart excellent moisture resistance, heat resistance, and long-term storage stability to the surface-treated copper foil. In order to attain these objects, the invention provides a surface-treated copper foil for producing printed wiring boards which has been subjected to nodular treatment and anti-corrosion treatment of a surface of a copper foil, wherein the anti-corrosion treatment includes forming a zinc or zinc alloy plating layer on a surface of the copper foil; forming an electrolytic chromate layer on the zinc or zinc alloy plating layer; forming a chromic-ion-containing silane coupling agent-adsorbed layer on the electrolytic chromate layer; and drying the copper foil for 2-6 seconds such that the copper foil reaches 105° C.-200° C.

摘要翻译： 本发明的目的是提供一种表面处理铜箔，其能够一致地获得在由铜箔制备的铜图案上测量的耐盐酸降解的剥离强度的百分比损失为10％以下，并且线宽为 通过排出镀锌或镀锌合金的防腐铜箔中所用的硅烷偶联剂的最大效果，可以得到0.2mm。 另一个目的是赋予表面处理铜箔优异的耐湿性，耐热性和长期保存稳定性。 为了达到上述目的，本发明提供一种表面处理铜箔，用于制造已对铜箔表面进行结节处理和防腐蚀处理的印刷线路板，其中防腐蚀处理包括形成 锌或锌合金镀层在铜箔的表面上; 在锌或锌合金镀层上形成电解铬酸盐层; 在电解铬酸盐层上形成含铬离子的硅烷偶联剂吸附层; 并将铜箔干燥2-6秒，使铜箔达到105℃-200℃。

公开(公告)号：US06531045B2

公开(公告)日：2003-03-11

申请号：US09769244

申请日：2001-01-26

申请人： Masakazu Mitsuhashi ,  Takashi Kataoka ,  Naotomi Takahashi

发明人： Masakazu Mitsuhashi ,  Takashi Kataoka ,  Naotomi Takahashi

IPC分类号： C25D510

CPC分类号： C23C28/00 ,  C23C2222/20 ,  C25D1/04 ,  C25D3/565 ,  C25D5/16 ,  C25D5/48 ,  H05K3/384 ,  H05K3/389 ,  H05K2201/0355 ,  H05K2203/0307 ,  H05K2203/0723 ,  H05K2203/1105 ,  Y10T428/12431

摘要： The invention provides a surface-treated copper foil for producing printed wiring boards whose surface has been subjected to nodular treatment and anti-corrosion treatments, wherein the anti-corrosion treatment includes forming a zinc-copper-nickel ternary alloy anti-corrosive plating layer on a surface of the copper foil; forming an electrolytic chromate layer on the anti-corrosive plating layer; forming a silane-coupling-agent-absorbed layer on the electrolytic chromate layer; and drying the copper foil for 2-6 seconds such that the copper foil reaches 105° C.-200° C.

摘要翻译： 本发明提供一种表面处理铜箔，用于制造其表面进行结核处理和防腐处理的印刷线路板，其中防腐蚀处理包括：将锌 - 铜 - 镍三元合金防腐蚀镀层 铜箔表面; 在所述防腐镀层上形成电解铬酸盐层; 在电解铬酸盐层上形成硅烷偶联剂吸收层; 并将铜箔干燥2-6秒，使铜箔达到105℃-200℃。

公开(公告)号：US06585877B2

公开(公告)日：2003-07-01

申请号：US09769252

申请日：2001-01-26

申请人： Masakazu Mitsuhashi ,  Takashi Kataoka ,  Naotomi Takahashi

发明人： Masakazu Mitsuhashi ,  Takashi Kataoka ,  Naotomi Takahashi

IPC分类号： C25D550

CPC分类号： C23C28/00 ,  C23C2222/20 ,  C25D1/04 ,  C25D3/38 ,  C25D3/58 ,  C25D5/16 ,  C25D5/48 ,  H05K3/384 ,  H05K3/389 ,  H05K2201/0355 ,  H05K2203/0307 ,  H05K2203/0723 ,  H05K2203/1105 ,  Y10T428/12438 ,  Y10T428/12472 ,  Y10T428/12569 ,  Y10T428/12611 ,  Y10T428/1291

摘要： An object of the invention is to provide a surface-treated copper foil capable of consistently attaining a percent loss of peel strength in resistance against hydrochloric acid degradation of 10% or less as measured on a copper pattern prepared from the copper foil and having a line width of 0.2 mm, by bringing out the maximum effect of the silane coupling agent employed in brass-plated anti-corrosive copper foil. The Another object is to impart excellent moisture resistance to the surface-treated copper foil. In order to attain these objects, the invention provides a surface-treated copper foil for producing printed wiring boards which has been subjected to nodular treatment and anti-corrosion treatment of a surface of a copper foil, wherein the anti-corrosion treatment includes forming a zinc-copper (brass) plating layer on a surface of the copper foil; forming an electrodeposited chromate layer on the zinc-copper (brass) plating layer; forming a silane-coupling-agent-adsorbed layer on the electrodeposited chromate layer; and drying the copper foil for 2-6 seconds such that the copper foil reaches 105° C.-200° C.

摘要翻译： 本发明的目的是提供一种表面处理铜箔，其能够一致地获得耐盐酸降解的剥离强度的百分比损失为10％以下，由铜箔制成的铜图案上测量并具有线 宽度为0.2mm，通过提高镀铜防腐铜箔中使用的硅烷偶联剂的最大效果。 另一个目的是赋予表面处理铜箔优异的耐湿性。 为了达到上述目的，本发明提供一种表面处理铜箔，用于制造已对铜箔表面进行结节处理和防腐蚀处理的印刷线路板，其中防腐蚀处理包括形成 铜箔（黄铜）镀层在铜箔表面上; 在铜 - 铜（黄铜）镀层上形成电沉积铬酸盐层; 在电沉积的铬酸盐层上形成硅烷偶联剂吸附层; 并将铜箔干燥2-6秒，使铜箔达到105℃-200℃。