发明授权
- 专利标题: Low-activation energy silicon-containing resist system
- 专利标题(中): 低活化能含硅抗蚀剂体系
-
申请号: US10693199申请日: 2003-10-24
-
公开(公告)号: US06939664B2公开(公告)日: 2005-09-06
- 发明人: Wu-Song Huang , Robert D. Allen , Marie Angelopoulos , Ranee W. Kwong , Ratnam Sooriyakumaran
- 申请人: Wu-Song Huang , Robert D. Allen , Marie Angelopoulos , Ranee W. Kwong , Ratnam Sooriyakumaran
- 申请人地址: US NY Armonk
- 专利权人: International Business Machines Corporation
- 当前专利权人: International Business Machines Corporation
- 当前专利权人地址: US NY Armonk
- 代理商 Todd M.C. Li
- 主分类号: G03C1/76
- IPC分类号: G03C1/76 ; G03F20060101 ; G03F7/004 ; G03F7/075 ; G03E7/004
摘要:
Inventive silsesquioxane polymers are provided, and resist compositions that contain such silsesquioxane polymers are provided in which at least a portion of the silsesquioxane polymer contains fluorinated moieties, and at least a portion of the silisesquioxane polymer contains pendant solubility inhibiting acid-labile moieties that have low activation energy for acid-catalyzed cleaving, and the presence of high optical density moieties are minimized or avoided. The inventive polymer also contains pendant polar moieties that promote alkaline solubility of the resist in aqueous alkaline solutions. The inventive polymers are particularly useful in positive resist compositions. The invention encompasses methods of using such resist compositions in forming a patterned structure on a substrate, and particularly multilayer (e.g. bilayer) photolithographic methods, which methods are capable of producing high resolution images at wavelengths such as 193 nm and 157 nm.
公开/授权文献
- US20050089792A1 LOW-ACTIVATION ENERGY SILICON-CONTAINING RESIST SYSTEM 公开/授权日:2005-04-28
信息查询